发明申请
- 专利标题： Method and apparatus for substrate fabrication
- 专利标题（中）： 用于基板制造的方法和装置
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申请号： US10456160申请日： 2003-06-05
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公开(公告)号： US20060172061A1公开(公告)日： 2006-08-03
- 发明人: Toshimi Kohmura , Michael Walk
- 申请人： Toshimi Kohmura , Michael Walk
- 主分类号： B05D5/12
- IPC分类号： B05D5/12
摘要：
Numerous embodiments of a method and apparatus for forming a substrate are disclosed. In one embodiment, a method for substrate fabrication comprises imprinting one or more features on a substrate, depositing a protective layer on a substantial portion of the top surface of the substrate, applying a metal filled paste to at least a portion of the one or more features, removing a substantial portion of the protective layer, and curing the metal filled paste to form one or more conductive structures.
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