A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost layers of the conducting layers which includes a plurality of pad portions which are provided in positions opposite to a plurality of signal terminals of a connector component arranged in a predetermined form and perform electrical connection, reinforcing portions which are provided to extend from the pad portions respectively in a lengthwise direction, and land portions to perform the electrical connection to another layer of the conducting layers, and a solder resist provided on the outermost layer of the conducting layers to cover the reinforcing portion and having an opening portion to expose the pad portion.