发明申请
- 专利标题： Semiconductor package with plated connection
- 专利标题（中）： 半导体封装带电镀连接
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申请号： US11058913申请日： 2005-02-15
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公开(公告)号： US20060180931A1公开(公告)日： 2006-08-17
- 发明人: Leeshawn Luo , Kai Liu , Ming Sun , Xiao Zhang
- 申请人： Leeshawn Luo , Kai Liu , Ming Sun , Xiao Zhang
- 专利权人： Alpha & Omega Semiconductor, Inc.
- 当前专利权人： Alpha & Omega Semiconductor, Inc.
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
A semiconductor package and method for making a semiconductor package are disclosed. The semiconductor package has a top surface and a mounting surface and includes a die, a conducting connecting material, a plating material and an insulating material. The die has a processed surface facing towards the mounting surface of the semiconductor package. Exposed metal connections are at the processed surface of the die. The conducting connecting material is disposed on the exposed metal connections. The plating material is in contact with the conducting connecting material. The insulating material is formed around the conducting connecting material, and the plating material extends to the exterior of the insulating material.
公开/授权文献
- US07394151B2 Semiconductor package with plated connection 公开/授权日：2008-07-01
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