发明申请
US20060186439A1 Semiconductor device, a manufacturing method thereof, and a camera 有权
半导体装置及其制造方法以及照相机

  • 专利标题: Semiconductor device, a manufacturing method thereof, and a camera
  • 专利标题(中): 半导体装置及其制造方法以及照相机
  • 申请号: US11407270
    申请日: 2006-04-20
  • 公开(公告)号: US20060186439A1
    公开(公告)日: 2006-08-24
  • 发明人: Hiroshi Tanaka
  • 申请人: Hiroshi Tanaka
  • 优先权: JP2003-312253 20030904
  • 主分类号: H01L27/148
  • IPC分类号: H01L27/148 H01L21/339
Semiconductor device, a manufacturing method thereof, and a camera
摘要:
A semiconductor device includes a transfer channel for transferring charge generated by photoelectric conversion, an insulating film formed on the transfer channel, and a transfer electrode for applying a transfer voltage to the transfer channel via the insulating film. The insulating film has a first thickness and a second thickness that is thinner than the first thickness. The insulating film has the first thickness below both ends of the transfer electrode in a width direction of the transfer channel that is orthogonal to a charge transfer direction through the transfer channel, and the insulating film has the second thickness on a part including a center of the transfer channel in the width direction.
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