- 专利标题: Working method for forming minute holes, tool used in the method, method and apparatus for manufacturing liquid ejecting head
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申请号: US11413591申请日: 2006-04-28
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公开(公告)号: US20060191389A1公开(公告)日: 2006-08-31
- 发明人: Hideyuki Ogawa , Koichi Saito , Nagamitsu Takashima , Noboyuki Soma , Katsunori Ono
- 申请人: Hideyuki Ogawa , Koichi Saito , Nagamitsu Takashima , Noboyuki Soma , Katsunori Ono
- 专利权人: SEIKO EPSON CORPORATION
- 当前专利权人: SEIKO EPSON CORPORATION
- 优先权: JPP2004-249598 20040830; JPP2004-253846 20040901
- 主分类号: B26D1/00
- IPC分类号: B26D1/00
摘要:
A punching apparatus forms a hole at a bottom portion of each of recesses which are formed in a metal plate in advance and arrayed in a first direction. A female die supports the metal plate. A male die is opposed to the recess and provided with a punch array in which a plurality of punches in the first direction. The male die is movable in a second direction perpendicular to the first direction to form the hole with each of the punches. The punches include first punches each having a distal end face which is slant in the second direction. A slant angle of the distal end face corresponds to a warp of the plate member due to the formation of the recesses.
公开/授权文献
- US07543381B2 Method of manufacturing a liquid ejecting head 公开/授权日:2009-06-09
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