发明申请
- 专利标题： Integrated circuit package and method of manufacture thereof
- 专利标题（中）： 集成电路封装及其制造方法
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申请号： US11066875申请日： 2005-02-25
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公开(公告)号： US20060192273A1公开(公告)日： 2006-08-31
- 发明人: Bernhard Lange , William Boyd
- 申请人： Bernhard Lange , William Boyd
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An integrated circuit (IC) package 100 comprises an IC 102 and leads 104 coupled to the IC. Each lead has a first end 106 configured to be coupled to the integrated circuit and a second end 108 configured to pass through one of a plurality of mounting holes 110 extending through a mounting board 112. The leads comprise at least one positioning lead 114 comprising a stop 118 being a continuous part of the positioning lead and having a lateral dimension 120 greater than a diameter 122 of a first hole 124 of the plurality of mounting holes. The leads further comprise at least one non-positioning lead 116 having a continuous uniformly shaped body 130 with a lateral dimension 132 less than a diameter 134 of a second hole 136 of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.
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