公开(公告)号：US20120211895A1

公开(公告)日：2012-08-23

申请号：US13366607

申请日：2012-02-06

申请人： Bernhard LANGE ,  Thies PUCHERT

发明人： Bernhard LANGE ,  Thies PUCHERT

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L23/5389 ,  H01L23/3677 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/2105 ,  H01L2224/221 ,  H01L2224/2518 ,  H01L2224/9202 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/10253 ,  H05K1/0206 ,  H05K1/185 ,  H05K2201/066 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A semiconductor device comprising a semiconductor die that is embedded in a package, wherein the die has a front side comprising a plurality of pads to be bonded to terminals of the package, and wherein a backside of the die is coupled to a backside surface of the package by a thermal bridge.

摘要翻译： 一种半导体器件，包括嵌入在封装中的半导体管芯，其中所述管芯具有包括要与所述封装的端子接合的多个焊盘的前侧，并且其中所述管芯的背面连接到所述封装的背面 由热桥包装。

公开(公告)号：US07488623B2

公开(公告)日：2009-02-10

申请号：US11774879

申请日：2007-07-09

申请人： Steven A Kummerl ,  Anthony L Coyle ,  Bernhard Lange

发明人： Steven A Kummerl ,  Anthony L Coyle ,  Bernhard Lange

IPC分类号： H01L21/00

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.

摘要翻译： 一种具有第一和第二封装侧的集成电路芯片封装组件。 集成电路芯片具有基板侧和有源电路侧。 芯片包括形成在有源电路侧的集成电路器件。 芯片的有源电路侧位于第一封装侧。 模片垫具有从其延伸的至少一个浇道构件，其可以朝着第一封装侧弯曲。 芯片的有源电路侧连接到管芯焊盘。 芯片焊盘相对于芯片在第一封装侧。 封装模具化合物形成在芯片焊盘，芯片的至少一部分和流道部件的至少一部分之上。 芯片的基板侧的至少一部分和/或流道部件的至少一部分可以不被封装模具化合物覆盖。

公开(公告)号：US20080093715A1

公开(公告)日：2008-04-24

申请号：US11874760

申请日：2007-10-18

申请人： Bernhard Lange ,  Steven Kummerl

发明人： Bernhard Lange ,  Steven Kummerl

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/3114 ,  H01L21/4821 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An interference interlock between leadframe features and a mold compound is provided in a packaged semiconductor device by exposing at least one predetermined surface area to an etching process prior to a molding step. This produces an etched recess with a recessed wall delimited by a step wall, generally perpendicular and adjacent to the recessed wall. The step wall is partially undercut by etching. During the molding step, the recessed wall and the step wall are both contacted by and embedded in the molding compound.

摘要翻译： 在封装半导体器件中，通过在模制步骤之前将至少一个预定表面区域暴露于蚀刻工艺来提供引线框架特征与模具化合物之间的干涉互锁。 这产生具有凹陷壁的蚀刻凹槽，该凹壁由阶梯壁限定，大体上垂直并且与凹壁相邻。 台阶壁通过蚀刻部分地被底切。 在成型步骤期间，凹壁和台阶壁都与模塑料接触并嵌入模塑料中。

公开(公告)号：US20080020517A1

公开(公告)日：2008-01-24

申请号：US11831458

申请日：2007-07-31

申请人： Steven Kummerl ,  Bernhard Lange ,  Anthony Coyle

发明人： Steven Kummerl ,  Bernhard Lange ,  Anthony Coyle

IPC分类号： H01L21/00

CPC分类号： H01L23/4334 ,  H01L23/49537 ,  H01L23/49568 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P1/387 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.

摘要翻译： 根据本发明的实施例，可操作以便于散热的能量的系统包括模具化合物，模具，第一引线框架和第二引线框架。 模具设置在模具化合物内，并且在操作中产生热能。 第一引线框架至少部分地设置在模具化合物内，并且可操作以促进信号的传输。 第二引线框架至少部分地设置在化合物内，至少部分地与第一引线框架分离，并且可操作以便于散热热能。

公开(公告)号：US20060289971A1

公开(公告)日：2006-12-28

申请号：US11168000

申请日：2005-06-27

申请人： Bernhard Lange ,  Steven Kummerl

发明人： Bernhard Lange ,  Steven Kummerl

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device comprising a leadframe (903), which has first (903a) and second (903b) surfaces, a planar pad (910) of a certain size, and a plurality of non-coplanar members (913) adjoining the pad. The device further has a heat spreader (920) with first (920a) and second (920b) surfaces, a planar pad of a size matching the leadframe pad size, and contours (922), into which the leadframe members are inserted so that the first spreader pad surface touches the second leadframe pad surface across the pad size. A semiconductor chip (904) is mounted on the first leadframe pad surface. Encapsulation material (930), preferably molding compound, covers the chip, but leaves the second spreader surface uncovered.

摘要翻译： 一种半导体器件，包括具有第一（903a）和第二（903b）表面的引线框架（903），具有一定尺寸的平面焊盘（910）和与所述焊盘相邻的多个非共面构件（913） 。 该装置还具有带有第一（920a）和第二（920b）表面的散热器（920），具有与引线框垫尺寸相匹配的尺寸的平面焊盘和引线框架构件插入其中的轮廓（922） 第一扩散器焊盘表面穿过焊盘尺寸接触第二引线框焊盘表面。 半导体芯片（904）安装在第一引线框焊盘表面上。 封装材料（930），优选模塑料覆盖芯片，但是将第二撒布机表面露出。

公开(公告)号：US20060278682A1

公开(公告)日：2006-12-14

申请号：US11148687

申请日：2005-06-09

申请人： Bernhard Lange ,  Steven Kummeri

发明人： Bernhard Lange ,  Steven Kummeri

IPC分类号： B23K31/02 ,  B23K37/00

CPC分类号： B23K20/005 ,  B23K20/004 ,  B23K20/106 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.

摘要翻译： 一种用于将带状线（104）接合到工件（106）的装置（100）和方法（200），包括通过超声波接合毛细管（102）的通道（116）馈送带状线并将带状线夹紧 通过可操作地耦合到粘结毛细管的夹钳（118）将粘结毛细管的接合表面（120）。 带状线（104）沿粘结毛细管（102）的接合表面（112）结合到工件（106）上，并且至少部分地穿过接合表面和粘结毛细管的接合表面（120）之间 通过切割工具（124）。 切割工具（124）可以包括定位在接合表面（112）和接合表面（120）之间的细长构件（126），并且可以具有定位在其远端（130）处的切割刀片（128）。 切割工具（124）还可以包括环形切割器（132），其中，带状丝线穿过具有围绕其内径限定的切割表面（138）的环（134）。

公开(公告)号：US20060263944A1

公开(公告)日：2006-11-23

申请号：US11134952

申请日：2005-05-23

申请人： Bernhard Lange

发明人： Bernhard Lange

IPC分类号： H01L21/00

CPC分类号： H01L23/36 ,  H01L23/4334 ,  H01L23/49568 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one embodiment of the invention, a method of die attach includes providing a chip, forming a heat conductive metal layer outwardly from a backside of the chip, and coupling the chip to a substrate. The heat conductive metal layer has a thickness of at least 0.5 mils.

摘要翻译： 根据本发明的一个实施例，芯片附接的方法包括提供芯片，从芯片的背面向外形成导热金属层，并将芯片耦合到基板。 导热金属层的厚度至少为0.5密耳。

公开(公告)号：US20060071351A1

公开(公告)日：2006-04-06

申请号：US10952342

申请日：2004-09-28

申请人： Bernhard Lange

发明人： Bernhard Lange

IPC分类号： H01L23/28

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package comprising a chip, a die pad adjacent the chip, said die pad having a side facing away from the chip, a portion of said side separated from an adjacent package surface by a distance greater than zero. The package further comprises mold compound abutting the chip and the die pad, wherein the distance between said portion and said adjacent package surface varies.

摘要翻译： 一种半导体封装，包括芯片，与所述芯片相邻的芯片焊盘，所述芯片焊盘具有背离所述芯片的一侧，所述侧面的一部分与相邻的封装表面分开大于零的距离。 该包装还包括邻接芯片和芯片焊盘的模具化合物，其中所述部分和所述相邻封装表面之间的距离变化。

公开(公告)号：US20060033185A1

公开(公告)日：2006-02-16

申请号：US10917036

申请日：2004-08-12

申请人： Steven Kummerl ,  Anthony Coyle ,  Bernhard Lange

发明人： Steven Kummerl ,  Anthony Coyle ,  Bernhard Lange

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.

公开(公告)号：US20120193801A1

公开(公告)日：2012-08-02

申请号：US13351104

申请日：2012-01-16

申请人： Johann Gross ,  Bernhard Lange

发明人： Johann Gross ,  Bernhard Lange

IPC分类号： H01L23/49 ,  H01P11/00 ,  B23K26/00 ,  B23K31/02 ,  B23K1/20

CPC分类号： G06K19/07754 ,  H01L2224/4813 ,  Y10T29/49016

摘要： An RFID transponder having a semiconductor die with a solderable contact area and an antenna made from a winding wire, wherein the winding wire is soldered to the contact area, and the solderable contact area is made from a nickel based alloy.

摘要翻译： 一种具有可焊接接触区域的半导体管芯和由绕组线制成的天线的RFID应答器，其中绕组线焊接到接触区域，并且可焊接接触区域由镍基合金制成。