发明申请
- 专利标题： Method and device for sticking tape
- 专利标题（中）： 粘贴胶带的方法和装置
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申请号： US10552410申请日： 2004-04-07
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公开(公告)号： US20060194412A1公开(公告)日： 2006-08-31
- 发明人: Takehito Nakayama
- 申请人： Takehito Nakayama
- 国际申请： PCT/JP04/05020 WO 20040407
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; B23P19/00
摘要：
Tapes are attached to a long support film, and the support film is attached to frame member at positions where the tape to be stuck to an adherend such as a semiconductor wafer, is included in a frame of a frame member. The support film is pressed to stick the tape to the adherend, and the support film is released from the tape. The support film is transferred and the above operations are repeated to stick the tapes to the respective adherends. In this manner, the tension to the tape is diffused to the support film, and the frame member causes the tension of the support film to reside outside of the frame. Accordingly, the tape stuck to the adherend has reduced residual stress and the adherend such as a thin semiconductor wafer to which the tape has been stuck is free from warpage which would otherwise be caused by a tape applied under tension.
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