公开(公告)号：US20090208688A1

公开(公告)日：2009-08-20

申请号：US11884467

申请日：2006-02-03

申请人： Takehito Nakayama ,  Kazuya Katoh ,  Takuya Hayasaka

发明人： Takehito Nakayama ,  Kazuya Katoh ,  Takuya Hayasaka

IPC分类号： B32B33/00 ,  B32B38/10

CPC分类号： G09F3/02 ,  B32B3/02 ,  B32B7/06 ,  B32B43/003 ,  B32B2310/0843 ,  C09J7/20 ,  C09J2201/20 ,  G11B7/26 ,  Y10T156/1084 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/1486 ,  Y10T428/149 ,  Y10T428/1495 ,  Y10T428/15 ,  Y10T428/24 ,  Y10T428/24479 ,  Y10T428/2457 ,  Y10T428/24777

摘要： A laminate is produced in which a long release sheet 2A, an adhesive layer 3A and a base material 4A are laminated together, and the base material 4A and the adhesive layer 3A are cut (half cut) so as not to penetrate through the release sheet 2A, so as to divide the base material 4A and the adhesive layer 3A into cover sheet portions 51A, bolstering portions 52A and a remainder portion 53A. The remainder portion 53A is then peeled off and removed, and an outer end portion of each of the bolstering portions 52A is half cut so as not to penetrate through the release sheet 2A, raised portions 6A being formed through the half cutting. The laminate sheet can be produced at low cost, and defects can be prevented from being formed on the adhesive sheet when the laminate sheet is wound into a roll.

摘要翻译： 制备层压体，其中将长的剥离片2A，粘合剂层3A和基材4A层合在一起，并且将基材4A和粘合剂层3A切割（半切），以便不穿透剥离片 如图2A所示，将基材4A和粘合层3A分割成盖片部分51A，支撑部分52A和其余部分53A。 然后将剩余部分53A剥离除去，并且每个支撑部分52A的外端部分被半切，以便不穿透剥离片2A，通过半切割形成凸起部分6A。 可以低成本地制造层压片材，并且当层压片材卷成卷时，可以防止在粘合片上形成缺陷。

公开(公告)号：US07232501B2

公开(公告)日：2007-06-19

申请号：US11010360

申请日：2004-12-14

申请人： Kazuya Katoh ,  Jun Akiwa ,  Takehito Nakayama

发明人： Kazuya Katoh ,  Jun Akiwa ,  Takehito Nakayama

IPC分类号： B32B38/10 ,  B29C65/14 ,  B29C33/68 ,  B32B37/16 ,  B32B38/04

CPC分类号： G11B7/26 ,  B32B7/12 ,  C09J7/20 ,  C09J7/403 ,  Y10S428/906 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/1075 ,  Y10T156/1082 ,  Y10T156/1084 ,  Y10T156/1085 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/149 ,  Y10T428/1495 ,  Y10T428/24777 ,  Y10T428/24793 ,  Y10T428/2495

摘要： An adhesive sheet 301A having a predetermined form is laminated onto a long release sheet 2A, and a protective member 5A which is thicker than the adhesive sheet 301A is provided in a position so as not to overlap the adhesive sheet 301A when a laminate sheet 1A is wound into a roll. According to this laminate sheet 1A, defects can be prevented from forming on the adhesive sheet 301A when the laminate sheet 1A is wound into a roll.

摘要翻译： 将具有预定形式的粘合片301A层压到长剥离片2A上，并且比粘合片301A厚的保护构件5A设置在不与粘合片301A重叠的位置，当 将层叠片材1A卷成卷。 根据该层压片材1A，当层压片材1A卷绕成卷时，可以防止在粘合片301A上形成缺陷。

公开(公告)号：US20060194412A1

公开(公告)日：2006-08-31

申请号：US10552410

申请日：2004-04-07

申请人： Takehito Nakayama

发明人： Takehito Nakayama

IPC分类号： H01L21/30 ,  B23P19/00

CPC分类号： H01L21/67132 ,  B65H37/002 ,  B65H2701/194 ,  Y10T29/53261

摘要： Tapes are attached to a long support film, and the support film is attached to frame member at positions where the tape to be stuck to an adherend such as a semiconductor wafer, is included in a frame of a frame member. The support film is pressed to stick the tape to the adherend, and the support film is released from the tape. The support film is transferred and the above operations are repeated to stick the tapes to the respective adherends. In this manner, the tension to the tape is diffused to the support film, and the frame member causes the tension of the support film to reside outside of the frame. Accordingly, the tape stuck to the adherend has reduced residual stress and the adherend such as a thin semiconductor wafer to which the tape has been stuck is free from warpage which would otherwise be caused by a tape applied under tension.

摘要翻译： 胶带连接到长支撑膜上，并且支撑膜在框架部件的框架中被包括在粘贴到诸如半导体晶片的被粘物的胶带的位置处附接到框架部件。 将支撑膜按压以将胶带粘贴到被粘物上，并且支撑膜从带上释放。 传送支撑膜并重复上述操作以将带粘贴到各个被粘物上。 以这种方式，向带的张力扩散到支撑膜，并且框架构件使支撑膜的张力驻留在框架的外部。 因此，粘附到被粘物上的带子具有减小的残余应力，并且诸如被粘附到其上的薄半导体晶片的被粘物没有翘曲，否则将由在张力下施加的带引起。

公开(公告)号：US08691357B2

公开(公告)日：2014-04-08

申请号：US13497866

申请日：2010-09-27

申请人： Naoki Taya ,  Takehito Nakayama ,  Hideharu Tajima ,  Yasuhiro Harada ,  Masaki Yamamoto ,  Hirohisa Yamada

发明人： Naoki Taya ,  Takehito Nakayama ,  Hideharu Tajima ,  Yasuhiro Harada ,  Masaki Yamamoto ,  Hirohisa Yamada

IPC分类号： G11B7/24

CPC分类号： G11B7/256 ,  G11B7/24024 ,  G11B7/24056 ,  G11B7/24065

摘要： A pressure-sensitive adhesive sheet 1 for an optical data recording medium D1 from which a signal with a mark length shorter than the resolution limit of an optical system of a reproducing device is capable of being reproduced by reproduction light emitted during reproducing, the pressure-sensitive adhesive sheet 1 having an adhesive transparent resin layer 11 to be disposed on an data recording layer 3 of the optical data recording medium D1, the transparent resin layer 11 having a (meth)acrylate copolymer containing no acidic group as a main component, the transparent resin layer 11 having a storage elastic modulus at 23° C. of 1.5×105 Pa or less and a gel fraction of 68 wt % or more. The transparent resin layer 11 of this pressure-sensitive adhesive sheet 1 for an optical data recording medium can be used for producing an optical data recording medium which can reproduce from a mark with a length shorter than the resolution of an optical system of a reproducing device, and which is stable against changes in the external environment when responding to status of use.

摘要翻译： 用于光学数据记录介质D1的压敏粘合片1，其标记长度短于再现装置的光学系统的分辨率极限的信号能够通过再现期间发出的再现光再现， 具有要设置在光学数据记录介质D1的数据记录层3上的粘合剂透明树脂层11的粘合片1，具有不含酸性基团的（甲基）丙烯酸酯共聚物作为主要成分的透明树脂层11， 在23℃下的储能弹性模量为1.5×10 5 Pa以下，凝胶率为68重量％以上的透明树脂层11。 用于光学数据记录介质的该粘合片1的透明树脂层11可以用于制造光学数据记录介质，该光学数据记录介质可以从长度短于再现装置的光学系统的分辨率的标记再现 对应用状况的外部环境变化是稳定的。

公开(公告)号：US20120246666A1

公开(公告)日：2012-09-27

申请号：US13497866

申请日：2010-09-27

申请人： Naoki Taya ,  Takehito Nakayama ,  Hideharu Tajima ,  Yasuhiro Harada ,  Masaki Yamamoto ,  Hirohisa Yamada

发明人： Naoki Taya ,  Takehito Nakayama ,  Hideharu Tajima ,  Yasuhiro Harada ,  Masaki Yamamoto ,  Hirohisa Yamada

IPC分类号： G11B7/241 ,  G11B19/20 ,  B32B3/02 ,  C09J133/26 ,  B32B7/12 ,  C08F220/56 ,  G11B7/00 ,  C09J7/02

CPC分类号： G11B7/256 ,  G11B7/24024 ,  G11B7/24056 ,  G11B7/24065

摘要： A pressure-sensitive adhesive sheet 1 for an optical data recording medium D1 from which a signal with a mark length shorter than the resolution limit of an optical system of a reproducing device is capable of being reproduced by reproduction light emitted during reproducing, the pressure-sensitive adhesive sheet 1 having an adhesive transparent resin layer 11 to be disposed on an data recording layer 3 of the optical data recording medium D1, the transparent resin layer 11 having a (meth)acrylate copolymer containing no acidic group as a main component, the transparent resin layer 11 having a storage elastic modulus at 23° C. of 1.5×105 Pa or less and a gel fraction of 68 wt % or more. The transparent resin layer 11 of this pressure-sensitive adhesive sheet 1 for an optical data recording medium can be used for producing an optical data recording medium which can reproduce from a mark with a length shorter than the resolution of an optical system of a reproducing device, and which is stable against changes in the external environment when responding to status of use.

摘要翻译： 用于光学数据记录介质D1的压敏粘合片1，其标记长度短于再现装置的光学系统的分辨率极限的信号能够通过再现期间发出的再现光再现， 具有要设置在光学数据记录介质D1的数据记录层3上的粘合剂透明树脂层11的粘合片1，具有不含酸性基团的（甲基）丙烯酸酯共聚物作为主要成分的透明树脂层11， 在23℃下的储能弹性模量为1.5×10 5 Pa以下，凝胶率为68重量％以上的透明树脂层11。 用于光学数据记录介质的该粘合片1的透明树脂层11可以用于制造光学数据记录介质，该光学数据记录介质可以从长度短于再现装置的光学系统的分辨率的标记再现 对应用状况的外部环境变化是稳定的。

公开(公告)号：US20070036931A1

公开(公告)日：2007-02-15

申请号：US11544572

申请日：2006-10-10

申请人： Kazuya Katoh ,  Jun Akiwa ,  Takehito Nakayama

发明人： Kazuya Katoh ,  Jun Akiwa ,  Takehito Nakayama

IPC分类号： B32B33/00

CPC分类号： G11B7/26 ,  B32B7/12 ,  C09J7/20 ,  C09J7/403 ,  Y10S428/906 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/1075 ,  Y10T156/1082 ,  Y10T156/1084 ,  Y10T156/1085 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/149 ,  Y10T428/1495 ,  Y10T428/24777 ,  Y10T428/24793 ,  Y10T428/2495

摘要： An adhesive sheet 301A having a predetermined form is laminated onto a long release sheet 2A, and a protective member 5A which is thicker than the adhesive sheet 301A is provided in a position so as not to overlap the adhesive sheet 301A when a laminate sheet 1A is wound into a roll. According to this laminate sheet 1A, defects can be prevented from forming on the adhesive sheet 301A when the laminate sheet 1A is wound into a roll.

摘要翻译： 将具有预定形式的粘合片301A层压到长剥离片2A上，并且比粘合片301A厚的保护构件5A设置在不与粘合片301A重叠的位置，当 将层叠片材1A卷成卷。 根据该层压片材1A，当层压片材1A卷绕成卷时，可以防止在粘合片301A上形成缺陷。

公开(公告)号：US08323761B2

公开(公告)日：2012-12-04

申请号：US11884467

申请日：2006-02-03

申请人： Takehito Nakayama ,  Kazuya Katoh ,  Takuya Hayasaka

发明人： Takehito Nakayama ,  Kazuya Katoh ,  Takuya Hayasaka

IPC分类号： B32B3/30 ,  B32B3/02 ,  B65D65/28 ,  G09F3/00

CPC分类号： G09F3/02 ,  B32B3/02 ,  B32B7/06 ,  B32B43/003 ,  B32B2310/0843 ,  C09J7/20 ,  C09J2201/20 ,  G11B7/26 ,  Y10T156/1084 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/1486 ,  Y10T428/149 ,  Y10T428/1495 ,  Y10T428/15 ,  Y10T428/24 ,  Y10T428/24479 ,  Y10T428/2457 ,  Y10T428/24777

摘要： A laminate is produced in which a long release sheet 2A, an adhesive layer 3A and a base material 4A are laminated together, and the base material 4A and the adhesive layer 3A are cut (half cut) so as not to penetrate through the release sheet 2A, so as to divide the base material 4A and the adhesive layer 3A into cover sheet portions 51A, bolstering portions 52A and a remainder portion 53A. The remainder portion 53A is then peeled off and removed, and an outer end portion of each of the bolstering portions 52A is half cut so as not to penetrate through the release sheet 2A, raised portions 6A being formed through the half cutting. The laminate sheet can be produced at low cost, and defects can be prevented from being formed on the adhesive sheet when the laminate sheet is wound into a roll.

摘要翻译： 制备层压体，其中将长的剥离片2A，粘合剂层3A和基材4A层合在一起，并且将基材4A和粘合剂层3A切割（半切），以便不穿透剥离片 如图2A所示，将基材4A和粘合层3A分割成盖片部分51A，支撑部分52A和其余部分53A。 然后将剩余部分53A剥离除去，并且每个支撑部分52A的外端部分被半切，以便不穿透剥离片2A，通过半切割形成凸起部分6A。 可以低成本地制造层压片材，并且当层压片材卷成卷时，可以防止在粘合片上形成缺陷。

公开(公告)号：US20100276074A1

公开(公告)日：2010-11-04

申请号：US12791015

申请日：2010-06-01

申请人： Takehito Nakayama

发明人： Takehito Nakayama

IPC分类号： B29C65/52

CPC分类号： H01L21/67132 ,  B65H37/002 ,  B65H2701/194 ,  Y10T29/53261

摘要： Tapes are attached to a long support film, and the support film is attached to a frame member at positions where the tape to be stuck to an adherent, such as a semiconductor wafer, is included in a frame of a frame member. The support film is pressed to stick the tape to the adherend, and the support film is released from the tape. The support film is transferred and the above operations are repeated to stick the tapes to the respective adherends. In this manner, the tension to the tape is diffused to the support film, and the frame member causes the tension of the support film to reside outside of the frame. Accordingly, the tape stuck to the adherend has reduced residual stress and the adherend such as a thin semiconductor wafer to which the tape has been stuck is free from warpage which would otherwise be caused by a tape applied under tension.

摘要翻译： 胶带连接到长支撑膜上，并且支撑膜在框架部件的框架中被包括在粘附到粘附剂如半导体晶片的位置处的框架部件附接。 将支撑膜按压以将胶带粘贴到被粘物上，并且支撑膜从带上释放。 传送支撑膜并重复上述操作以将带粘贴到各个被粘物上。 以这种方式，向带的张力扩散到支撑膜，并且框架构件使支撑膜的张力驻留在框架的外部。 因此，粘附到被粘物上的带子具有减小的残余应力，并且诸如被粘附到其上的薄半导体晶片的被粘物没有翘曲，否则将由在张力下施加的带引起。