A method for partially plating balls for application in ball grid array packages is disclosed. The balls are positioned in recesses of a clam tool made of two parts, such that a gap remains between these parts. A first polymer layer is formed in this gap and one part of the clam tool is thereafter removed. The resulting exposed portions of the balls are covered with a second polymer. The second part of the clam tool is removed and the resulting second exposed portions of the balls are plated with a noble metal, such as gold or palladium. After the balls have been partially plated, the second polymer is removed, leaving the partially plated balls embedded in the first polymer layer. The first polymer layer, preferably a soft foil, may be used to position the partially plated balls for attachment to an electronic module.