发明申请
- 专利标题: Fin field effect transistors having capping insulation layers
- 专利标题(中): Fin场效应晶体管具有封盖绝缘层
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申请号: US11433942申请日: 2006-05-15
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公开(公告)号: US20060202270A1公开(公告)日: 2006-09-14
- 发明人: Yong-Hoon Son , Si-Young Choi , Byeong-Chan Lee , Deok-Hyung Lee , In-Soo Jung
- 申请人: Yong-Hoon Son , Si-Young Choi , Byeong-Chan Lee , Deok-Hyung Lee , In-Soo Jung
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 优先权: KR10-2003-76960 20031031
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L27/01 ; H01L31/0392
摘要:
A field effect transistor includes a vertical fin-shaped semiconductor active region having an upper surface and a pair of opposing sidewalls on a substrate, and an insulated gate electrode on the upper surface and opposing sidewalls of the fin-shaped active region. The insulated gate electrode includes a capping gate insulation layer having a thickness sufficient to preclude formation of an inversion-layer channel along the upper surface of the fin-shaped active region when the transistor is disposed in a forward on-state mode of operation. Related fabrication methods are also discussed.
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