发明申请
- 专利标题： Method of mounting a substrate to a motherboard
- 专利标题（中）： 将基板安装在母板上的方法
-
申请号： US11078930申请日： 2005-03-11
-
公开(公告)号： US20060203459A1公开(公告)日： 2006-09-14
- 发明人: Thomas Morgan , Dudi Amir , Damion Searls
- 申请人： Thomas Morgan , Dudi Amir , Damion Searls
- 主分类号： H05K7/06
- IPC分类号： H05K7/06
摘要：
In one embodiment a method is provided. A method comprising forming a plurality of electromechanical formations to electromechanical couple a first printed circuit board to a second printed circuit board, wherein each electromechanical formation is of a first size; and forming at least one anchoring formation to anchor the first printed circuit board to the second printed circuit board, each anchoring formation being formed at a selected anchor point, and being of a second size which is greater than the first size.
信息查询
