公开(公告)号：US20070125833A1

公开(公告)日：2007-06-07

申请号：US11657197

申请日：2007-01-23

申请人： Dudi Amir ,  Damion Searls

发明人： Dudi Amir ,  Damion Searls

IPC分类号： A47J36/02

CPC分类号： H05K3/3436 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/1476 ,  Y02P70/613 ,  H01L2924/00

摘要： A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is placed onto the printed circuit board over the conductive region and the solder is reflowed, forming a wide solder interconnection between the component and the conductive region of the printed circuit board.

摘要翻译： 具有焊膏覆盖的至少一个导电区域的印刷电路板具有放置在导电区域中的焊膏上的预成型焊料元件。 组件封装被放置在导电区域上的印刷电路板上，并且焊料被回流，在组件和印刷电路板的导电区域之间形成宽的焊料互连。

公开(公告)号：US20050235488A1

公开(公告)日：2005-10-27

申请号：US11168636

申请日：2005-06-28

申请人： Dudi Amir

发明人： Dudi Amir

IPC分类号： H05K3/34 ,  H01R9/00

CPC分类号： H05K3/3478 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/10371 ,  H05K2203/0415 ,  Y10T29/49126 ,  Y10T29/49144

摘要： A printed circuit board having at least one layer of conductive traces on an external surface has at least one preformed solder element placed on a conductive trace area of the printed circuit board requiring a greater than standard amount of solder. The at least one preformed solder element is reflowed to form a connection with the layer of printed solder.

公开(公告)号：US06626099B1

公开(公告)日：2003-09-30

申请号：US09434944

申请日：1999-11-05

申请人： Dudi Amir

发明人： Dudi Amir

IPC分类号： B41M112

CPC分类号： H05K3/1216

摘要： An apparatus for preventing media deposition in predetermined locations comprising at least one blocking cap connected to a pressurized squeegee head is disclosed. In one embodiment, a method for partially printing a circuit board is disclosed. The method comprises inserting one or more blocking caps inside a pressurized squeegee head and printing with the pressurized squeegee head. In this way, defined areas on the surface of a stencil or screen, over which the blocking caps travel, are skipped. In another embodiment, a new method for manufacturing printed circuit boards is described, comprising placing a component on a circuit board, performing burn-in or testing of the component, partially printing attachment media on the circuit board with a pressurized squeegee head containing one or more blocking caps, and placing additional components on the circuit board. In one embodiment, the circuit board is sold or returned to the circuit board designer before performing the partial printing step.

摘要翻译： 公开了一种用于防止在预定位置的介质沉积的装置，其包括连接到加压刮板头的至少一个阻挡盖。 在一个实施例中，公开了一种部分印刷电路板的方法。 该方法包括将一个或多个阻塞帽插入加压的刮刀头内部并用加压的刮刀头进行打印。 以这种方式，跳过阻挡帽行进的模板或屏幕表面上的限定区域。 在另一个实施例中，描述了用于制造印刷电路板的新方法，包括将部件放置在电路板上，执行部件的老化或测试，使用加压的刮板头将附接介质部分地印刷在电路板上， 更多阻塞帽，并在电路板上放置附加组件。 在一个实施例中，在执行部分打印步骤之前，电路板被出售或返回到电路板设计者。

公开(公告)号：US20060109121A1

公开(公告)日：2006-05-25

申请号：US10993895

申请日：2004-11-19

申请人： Terry Dishongh ,  Tom Pearson ,  Dudi Amir

发明人： Terry Dishongh ,  Tom Pearson ,  Dudi Amir

IPC分类号： G08B13/14

CPC分类号： H05K1/0266 ,  G06K19/07749 ,  G06K19/07758 ,  H05K1/16 ,  H05K2201/10098

摘要： A radio frequency identification (RFID) device may incorporate an existing feature on a substrate as an antenna. In some embodiments, the electromagnetic interference (EMI) guard ring on a substrate may form the antenna for the RFID device.

摘要翻译： 射频识别（RFID）设备可以将基板上的现有特征结合为天线。 在一些实施例中，衬底上的电磁干扰（EMI）保护环可以形成用于RFID设备的天线。

公开(公告)号：US20050225953A1

公开(公告)日：2005-10-13

申请号：US11148535

申请日：2005-06-08

申请人： Dudi Amir ,  Damion Searls

发明人： Dudi Amir ,  Damion Searls

IPC分类号： H05K1/02 ,  H05K3/34 ,  H05K7/02 ,  H05K1/18 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K3/3436 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/1476 ,  Y02P70/613 ,  H01L2924/00

摘要： A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is placed onto the printed circuit board over the conductive region and the solder is reflowed, forming a wide solder interconnection between the component and the conductive region of the printed circuit board.

摘要翻译： 具有焊膏覆盖的至少一个导电区域的印刷电路板具有放置在导电区域中的焊膏上的预成型焊料元件。 组件封装被放置在导电区域上的印刷电路板上，并且焊料被回流，在组件和印刷电路板的导电区域之间形成宽的焊料互连。

公开(公告)号：US06823783B2

公开(公告)日：2004-11-30

申请号：US10657680

申请日：2003-09-08

申请人： Dudi Amir

发明人： Dudi Amir

IPC分类号： B05C1704

CPC分类号： H05K3/1216

摘要： An apparatus for preventing media deposition in predetermined locations comprising at least one blocking cap connected to a pressurized squeegee head is disclosed. In one embodiment, a method for partially printing a circuit board is disclosed. The method comprises inserting one or more blocking caps inside a pressurized squeegee head and printing with the pressurized squeegee head. In this way, defined areas on the surface of a stencil or screen, over which the blocking caps travel, are skipped. In another embodiment, a new method for manufacturing printed circuit boards is described, comprising placing a component on a circuit board, performing burn-in or testing of the component, partially printing attachment media on the circuit board with a pressurized squeegee head containing one or more blocking caps, and placing additional components on the circuit board. In one embodiment, the circuit board is sold or returned to the circuit board designer before performing the partial printing step.

摘要翻译： 公开了一种用于防止在预定位置的介质沉积的装置，其包括连接到加压刮板头的至少一个阻挡盖。 在一个实施例中，公开了一种部分印刷电路板的方法。 该方法包括将一个或多个阻塞帽插入加压的刮刀头内部并用加压的刮刀头进行打印。 以这种方式，跳过阻挡帽行进的模板或屏幕表面上的限定区域。 在另一个实施例中，描述了用于制造印刷电路板的新方法，包括将部件放置在电路板上，执行部件的老化或测试，使用加压的刮板头将附接介质部分地印刷在电路板上， 更多阻塞帽，并在电路板上放置附加组件。 在一个实施例中，在执行部分打印步骤之前，电路板被出售或返回到电路板设计者。

公开(公告)号：US06787920B2

公开(公告)日：2004-09-07

申请号：US10179761

申请日：2002-06-25

申请人： Dudi Amir

发明人： Dudi Amir

IPC分类号： H01L2350

CPC分类号： H01L23/5386 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K1/111 ,  H05K1/112 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

摘要： A carrier substrate comprising a non-conductive substrate, one or more conductive regions on, under or within the non-conductive substrate, and a plurality of pads, selectively coupled with the conductive regions, to receive and couple with conductive elements of a component, wherein at least one pad is configured to receive and couple with two or more conductive elements of the component.

摘要翻译： 包括非导电衬底的载体衬底，在非导电衬底上，下面或内部的一个或多个导电区域，以及与导电区域选择性耦合以接收和耦合组件的导电元件的多个焊盘， 其中至少一个焊盘被配置为接收和耦合所述部件的两个或多个导电元件。

公开(公告)号：US20050211750A1

公开(公告)日：2005-09-29

申请号：US10812625

申请日：2004-03-29

申请人： Tom Pearson ,  Dudi Amir ,  Terrance Dishongh

发明人： Tom Pearson ,  Dudi Amir ,  Terrance Dishongh

IPC分类号： H01L21/48 ,  H01L23/50 ,  H05K1/02 ,  H05K1/16 ,  H05K3/34 ,  B23K31/02

CPC分类号： H05K3/3436 ,  H01L21/4853 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/0263 ,  H05K1/162 ,  H05K3/3452 ,  H05K2201/09236 ,  H05K2201/094 ,  H05K2201/099 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00

摘要： Solder connections are created between the substrate of an electronic package and a circuit board having lengths that are longer than the width. The solder connections are created by locating solder balls of power or ground connections close enough to one another so that, upon reflow to the circuit board the solder balls combine, creating a larger solder connection. Signal solder balls, however, remain separated. The power or ground solder balls on a particular bond pad are separated from one another by portions of a removable solder mask that keep the solder balls spherical in shape during solder ball attachment to the electronic package. However, it is removed prior to reflow to the circuit board, thus creating a larger, longer solder connection between the electronic package and circuit board.

摘要翻译： 在电子封装的基板和长度大于宽度的电路板之间产生焊接连接。 焊接连接是通过将功率或接地连接的焊球定位得彼此靠近而形成的，使得当回流到电路板时，焊球组合，产生更大的焊接连接。 然而，信号焊球保持分离。 特定接合焊盘上的电源或接地焊球通过可拆卸焊接掩模的一部分彼此分开，以在焊球附着到电子封装期间使焊球保持球形。 然而，它在回流到电路板之前被去除，从而在电子封装和电路板之间产生更大的更长的焊接连接。

公开(公告)号：US06555761B2

公开(公告)日：2003-04-29

申请号：US09751946

申请日：2000-12-29

申请人： Dudi Amir

发明人： Dudi Amir

IPC分类号： H01R1204

CPC分类号： H05K3/0094 ,  H05K3/3484 ,  H05K3/429 ,  H05K2201/09572 ,  H05K2203/1394 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A plated-through hole via is substantially filled with solder rather than with traditional polymer to reduce printed circuit board failure due to outgassing from improperly cured polymer via fill. The solder via fill is in some embodiments eutectic or high-temperature solder, and in some further embodiments is capped at least one end with a barrier.

公开(公告)号：US20060203459A1

公开(公告)日：2006-09-14

申请号：US11078930

申请日：2005-03-11

申请人： Thomas Morgan ,  Dudi Amir ,  Damion Searls

发明人： Thomas Morgan ,  Dudi Amir ,  Damion Searls

IPC分类号： H05K7/06

CPC分类号： H05K3/3436 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/09181 ,  H05K2201/094 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613

摘要： In one embodiment a method is provided. A method comprising forming a plurality of electromechanical formations to electromechanical couple a first printed circuit board to a second printed circuit board, wherein each electromechanical formation is of a first size; and forming at least one anchoring formation to anchor the first printed circuit board to the second printed circuit board, each anchoring formation being formed at a selected anchor point, and being of a second size which is greater than the first size.

摘要翻译： 在一个实施例中提供了一种方法。 一种方法，包括形成多个机电结构以将第一印刷电路板电耦合到第二印刷电路板，其中每个机电结构具有第一尺寸; 以及形成至少一个锚固结构以将所述第一印刷电路板锚定到所述第二印刷电路板，每个锚定结构形成在选定的锚定点处，并且具有大于所述第一尺寸的第二尺寸。