发明申请
- 专利标题： Substrate treating apparatus and substrate treating method
- 专利标题（中）： 基板处理装置及基板处理方法
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申请号： US11438613申请日： 2006-05-19
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公开(公告)号： US20060207969A1公开(公告)日： 2006-09-21
- 发明人: Hiroaki Sugimoto , Takeshi Yoshida , Hiroshi Kato , Takuya Kuroda , Tadashi Sasaki
- 申请人： Hiroaki Sugimoto , Takeshi Yoshida , Hiroshi Kato , Takuya Kuroda , Tadashi Sasaki
- 专利权人： Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人： Dainippon Screen Mfg. Co., Ltd.
- 优先权： JP2002-24365 20020131
- 主分类号： B08B3/12
- IPC分类号： B08B3/12 ; B44C1/22 ; H01L21/306 ; C23F1/00
摘要：
In a substrate treating unit, a removal liquid supplying mechanism supplies a removal liquid to the surface of a substrate. In order to retain the removal liquid on the surface of the substrate for a fixed time, a spin chuck is operated to spin the substrate at such a low speed as to retain the removal liquid on the substrate, or spins the substrate intermittently, or temporarily stops spinning of the substrate. Thus, treatment with the removal liquid progresses without a further supply of the removal liquid, thereby restraining consumption of the removal liquid.
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