发明申请
US20060210664A1 Apparatus of applying ultrasonic vibration to resin material, method of kneading, compounding and blending resin material by use of the ultrasonic vibration applying apparatus, and resin composition
审中-公开
使用超声波振动施加装置对树脂材料施加超声波振动的装置，捏合，混合和混合树脂材料的方法以及树脂组合物
- 专利标题： Apparatus of applying ultrasonic vibration to resin material, method of kneading, compounding and blending resin material by use of the ultrasonic vibration applying apparatus, and resin composition
- 专利标题（中）： 使用超声波振动施加装置对树脂材料施加超声波振动的装置，捏合，混合和混合树脂材料的方法以及树脂组合物
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申请号： US10559743申请日： 2004-07-17
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公开(公告)号： US20060210664A1公开(公告)日： 2006-09-21
- 发明人: Yoshiyuki Suetsugu , Yasuhiko Otsuki , Atsushi Sato
- 申请人： Yoshiyuki Suetsugu , Yasuhiko Otsuki , Atsushi Sato
- 申请人地址： JP Tokyo 100-8321
- 专利权人： Idemitsu Kosan Co., Ltd.
- 当前专利权人： Idemitsu Kosan Co., Ltd.
- 当前专利权人地址： JP Tokyo 100-8321
- 优先权： JP2003-197539 20030716
- 国际申请： PCT/JP04/10026 WO 20040717
- 主分类号： B29C35/12
- IPC分类号： B29C35/12
摘要：
There is here disclosed a technique which can improve mechanical properties such as strength and impact resistance of molded articles without noticeably changing molding materials and rebuilding a molding apparatus. In a molding method in which the molding materials are fed to a mold disposed at one end of a cylinder while the molding materials in the cylinder are molten and kneaded, the molding materials can be molded while vibration is applied to the molding materials in a direction crossing a flow direction of the resin material at right angles. The vibration does not have to possess any node portion on a surface which contacts the molding material.
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