发明申请
- 专利标题: Compound body manufacturing method, compound body manufacturing device, and compound body
- 专利标题(中): 复合体制造方法,复合体制造装置和复合体
-
申请号: US10541547申请日: 2004-01-05
-
公开(公告)号: US20060213064A1公开(公告)日: 2006-09-28
- 发明人: Makoto Katsumata , Hitoshi Ushijima , Hiroshi Suzuki , Kunio Okumura
- 申请人: Makoto Katsumata , Hitoshi Ushijima , Hiroshi Suzuki , Kunio Okumura
- 优先权: JP2003-000392 20030106
- 国际申请: PCT/JP04/00005 WO 20040105
- 主分类号: B21D47/00
- IPC分类号: B21D47/00
摘要:
A compound (1) is manufactured which has a metal outer part (3) having a hollow space (2) and a content material (4) formed in the hollow space (2). Namely, manufacture is made by including an outer part forming step to form an outer part and a content material forming step to form a content material (4) in the hollow space (2) by using a metal matrix melt to be die-molded and a filler contained in the melt. The outer part (3) has a desired exterior form. Meanwhile, the content material (4) is formed in a state the hollow space (2) is filled in order to lighten the weight and improve the strength of the compound (1).
信息查询