发明申请
- 专利标题： Perforation and grooving for polishing articles
- 专利标题（中）： 用于抛光物品的穿孔和开槽
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申请号： US11418557申请日： 2006-05-06
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公开(公告)号： US20060217049A1公开(公告)日： 2006-09-28
- 发明人: Shijian Li , Liang-Yuh Chen , Alain Duboust
- 申请人： Shijian Li , Liang-Yuh Chen , Alain Duboust
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 主分类号： H01L21/306
- IPC分类号： H01L21/306 ; B24D11/00
摘要：
Methods, articles of manufacture, and apparatus are provided for depositing and planarizing one or more layers of material on a substrate, or combinations thereof, are disclosed. In one embodiment, an article of manufacture is provided for polishing a substrate, comprising a polishing article having a polishing surface, a plurality of perforations formed in at least a portion of the polishing article for flow of material therethrough, and a plurality of grooves disposed in the polishing surface. The article of manufacture may be used in a method for processing a substrate, comprising positioning the substrate in an electrolyte solution containing a polishing article, optionally depositing a material on the substrate by an electrochemical deposition method, and polishing the substrate with the polishing article.
公开/授权文献
- US20070066200A9 Perforation and grooving for polishing articles 公开/授权日：2007-03-22
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