发明申请
- 专利标题： Headphone device
- 专利标题（中）： 耳机设备
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申请号： US11444805申请日： 2006-06-01
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公开(公告)号： US20060222197A1公开(公告)日： 2006-10-05
- 发明人: Naotaka Tsunoda , Koji Nageno
- 申请人： Naotaka Tsunoda , Koji Nageno
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JPJP2000-005975 20000107
- 主分类号： H04R25/00
- IPC分类号： H04R25/00
摘要：
A headphone device includes an earpad worn outside of the ear on the head of a user and a housing provided with a speaker unit as well as a fitting portion on which the earpad is fit. The earpad includes a cushion and a facing that covers the cushion. The earpad can be attached to and detached from the housing. The facing is detachable from the cushion to keep the earpad clean.
公开/授权文献
- US07245736B2 Headphone device 公开/授权日：2007-07-17
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