- 专利标题： Substrate and a method for polishing a substrate
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申请号： US11398703申请日： 2006-04-06
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公开(公告)号： US20060226124A1公开(公告)日： 2006-10-12
- 发明人: Kazuyoshi Nakamura , Toshihide Nakajima , Kousuke Nakajima , Takahisa Oonami
- 申请人： Kazuyoshi Nakamura , Toshihide Nakajima , Kousuke Nakajima , Takahisa Oonami
- 申请人地址： JP Sagamihara-shi
- 专利权人： OHARA INC.
- 当前专利权人： OHARA INC.
- 当前专利权人地址： JP Sagamihara-shi
- 优先权： JP2005-112070 20050408
- 主分类号： C03C15/00
- IPC分类号： C03C15/00 ; H01L21/461 ; H01L21/302 ; C23F1/00
摘要：
A substrate having flatness of less than 230 nmPV and surface roughness at RMS of less than 0.20 nm. is obtained by a method comprising: a process of polishing an object to be polished with a polishing pad comprising at least one layer having compressibility of 5% or below in a base layer of the polishing pad.
公开/授权文献
- US07553768B2 Substrate and a method for polishing a substrate 公开/授权日：2009-06-30