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公开(公告)号:US20060226124A1
公开(公告)日:2006-10-12
申请号:US11398703
申请日:2006-04-06
IPC分类号: C03C15/00 , H01L21/461 , H01L21/302 , C23F1/00
CPC分类号: B24B37/24
摘要: A substrate having flatness of less than 230 nmPV and surface roughness at RMS of less than 0.20 nm. is obtained by a method comprising: a process of polishing an object to be polished with a polishing pad comprising at least one layer having compressibility of 5% or below in a base layer of the polishing pad.
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公开(公告)号:US07553768B2
公开(公告)日:2009-06-30
申请号:US11398703
申请日:2006-04-06
IPC分类号: H01L21/302
CPC分类号: B24B37/24
摘要: A substrate having flatness of less than 230 nmPV and surface roughness at RMS of less than 0.20 nm. is obtained by a method comprising: a process of polishing an object to be polished with a polishing pad comprising at least one layer having compressibility of 5% or below in a base layer of the polishing pad.
摘要翻译: 平面度小于230nmPV的基板,RMS的表面粗糙度小于0.20nm。 是通过以下方法获得的:包括在抛光垫的基底层中用包括至少一层具有5%或更低的压缩率的层的抛光垫抛光待抛光物体的方法。
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