发明申请
- 专利标题: Substrate processing method and substrate processing apparatus
- 专利标题(中): 基板处理方法和基板处理装置
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申请号: US11389178申请日: 2006-03-27
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公开(公告)号: US20060234499A1公开(公告)日: 2006-10-19
- 发明人: Akira Kodera , Hirokuni Hiyama , Akio Shibata , Tsutomu Nakada , Tsuyoshi Sahoda
- 申请人: Akira Kodera , Hirokuni Hiyama , Akio Shibata , Tsutomu Nakada , Tsuyoshi Sahoda
- 优先权: JP2005-96511 20050329; JP2005-130850 20050428; JP2005-188959 20050628
- 主分类号: H01L21/4763
- IPC分类号: H01L21/4763 ; H01L21/76
摘要:
A substrate processing method forms a plated film which is thin and has a high flatness by covering the surface (outermost surface) of a substrate, excluding interior surfaces of recesses such as trenches, with a plating inhibiting material such as an SAM-forming molecular species. The substrate processing method comprises: preparing a substrate having recesses formed in a surface; attaching a plating inhibiting material for inhibiting plating to an outermost surface, which excludes interior surfaces of the recesses, of the substrate surface; and then carrying out electroplating of the surface of the substrate, thereby filling the recesses with a plated metal.