发明申请
- 专利标题: Substrate processing apparatus, substrate processing method, and substrate holding apparatus
- 专利标题(中): 基板处理装置,基板处理方法以及基板保持装置
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申请号: US10564980申请日: 2004-07-28
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公开(公告)号: US20060234503A1公开(公告)日: 2006-10-19
- 发明人: Kaoru Yamada , Takayuki Saito , Sumio Yabe , Kenya Ito , Masayuki Kamezawa , Masaya Seki , Ichiro Katakabe , Yuki Inoue
- 申请人: Kaoru Yamada , Takayuki Saito , Sumio Yabe , Kenya Ito , Masayuki Kamezawa , Masaya Seki , Ichiro Katakabe , Yuki Inoue
- 优先权: JP2003-289442 20030807; JP2003-289443 20030807; JP2003-317395 20030909; JP2004-003654 20040109; JP2004-114490 20040408
- 国际申请: PCT/JP04/11101 WO 20040728
- 主分类号: H01L21/44
- IPC分类号: H01L21/44 ; B65G47/91
摘要:
The present invention relates to a substrate processing apparatus and a substrate processing method for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. The present invention also relates to a substrate holding apparatus for holding and rotating a substrate. The substrate processing apparatus (1) for processing a substrate (W) while supplying a fluid to the substrate (W) includes a substrate holder (11) for holding and rotating the substrate (W), and a holder suction unit (24) for sucking the fluid from the substrate holder (11). The substrate holding apparatus includes a plurality of rollers (20) which are brought into contact with an edge portion of a substrate (W) so as to hold and rotate the substrate (W), and at least one moving mechanism (303a) for moving the rollers (20).
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