发明申请
US20060236536A1 Die apparatus, method for producing perforated work plate, perforated work plate, liquid-jet head and liquid-jet apparatus
审中-公开
模具装置，穿孔工作板的制造方法，穿孔工作板，喷液头和液体喷射装置
- 专利标题： Die apparatus, method for producing perforated work plate, perforated work plate, liquid-jet head and liquid-jet apparatus
- 专利标题（中）： 模具装置，穿孔工作板的制造方法，穿孔工作板，喷液头和液体喷射装置
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申请号： US11390305申请日： 2006-03-28
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公开(公告)号： US20060236536A1公开(公告)日： 2006-10-26
- 发明人: Koichi Saito , Narimitsu Saito , Shinichi Tonami , Nagamitsu Takashima , Ryoji Uesugi
- 申请人： Koichi Saito , Narimitsu Saito , Shinichi Tonami , Nagamitsu Takashima , Ryoji Uesugi
- 专利权人： SEIKO EPSON CORPORATION
- 当前专利权人： SEIKO EPSON CORPORATION
- 优先权： JP2005-092286 20050328; JP2005-096909 20050330
- 主分类号： B21D53/76
- IPC分类号： B21D53/76
摘要：
A die apparatus is composed of a lower receiving die, a round punch having the shape of a fine hole, and PET provided between the lower receiving die and the round punch. The round punch is passed through a work plate placed on the PET to cause a punched-out piece to remain within the PET, thereby boring the fine hole. The work plate having such fine holes is thus easily prepared, and applied as a filter for a liquid-jet head.
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