发明申请
US20060237855A1 Substrate for producing a soldering connection to a second substrate
审中-公开
用于产生与第二基板的焊接连接的基板
- 专利标题： Substrate for producing a soldering connection to a second substrate
- 专利标题（中）： 用于产生与第二基板的焊接连接的基板
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申请号： US11392255申请日： 2006-03-29
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公开(公告)号： US20060237855A1公开(公告)日： 2006-10-26
- 发明人: Steffen Kroehnert , Gunnar Petzold , Jens Oswald , Martin Reiss , Oliver Grassme , Kerstin Nocke , Knut Kahlisch , Soo Park
- 申请人： Steffen Kroehnert , Gunnar Petzold , Jens Oswald , Martin Reiss , Oliver Grassme , Kerstin Nocke , Knut Kahlisch , Soo Park
- 优先权： DE102005014665.1 20050329
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A substrate for producing a soldering connection to a second substrate is disclosed. Soldering pads are distributed on the substrate surface. Solder balls can be applied to these pads. A soldering pad has a top side area and side areas connected to a conductor track. A soldering mask with openings in the region of the soldering pads is applied to the substrate. A soldering pad is provided with holding mechanism for the solder balls in such a way that, within the top side area of the soldering pad, a depression is introduced in the direction of the substrate or an elevation rising above the top side area is applied.