公开(公告)号：US20090194890A1

公开(公告)日：2009-08-06

申请号：US12023557

申请日：2008-01-31

申请人： Knut Kahlisch ,  Martin Reiss ,  Joerg Keller

发明人： Knut Kahlisch ,  Martin Reiss ,  Joerg Keller

IPC分类号： H01L23/28

CPC分类号： H01L23/3114 ,  H01L23/3142 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05669 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/05042 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the invention relate generally to an integrated circuit and a memory module. In an embodiment of the invention, an integrated circuit is provided. The integrated circuit may include a semiconductor carrier including at least one electrically inactive region on an upper surface thereof, a passivation layer structure disposed above the upper surface of the semiconductor carrier, and at least one lithographic trench in the passivation layer structure above the at least one electrically inactive region on the upper surface of the semiconductor carrier.

摘要翻译： 本发明的实施例一般涉及集成电路和存储器模块。 在本发明的实施例中，提供集成电路。 集成电路可以包括半导体载体，该半导体载体在其上表面上包括至少一个电无活性区域，设置在半导体载体的上表面上方的钝化层结构，以及至少一个钝化层结构中的至少一个光刻沟槽 在半导体载体的上表面上的一个电无活性区域。

公开(公告)号：US07368322B2

公开(公告)日：2008-05-06

申请号：US11184532

申请日：2005-07-19

申请人： Martin Reiss ,  Juergen Grafe ,  Anton Legen ,  Manuel Carmona

发明人： Martin Reiss ,  Juergen Grafe ,  Anton Legen ,  Manuel Carmona

IPC分类号： H01L21/00

CPC分类号： H01L25/50 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.

摘要翻译： 电子部件包括通过彼此间隔开并且布置在芯片和基部之间的中间空间中的多个粘合剂焊盘附接到基部的基部和芯片。 芯片与基座的互连电连接。 粘合垫在芯片的整个表面区域上以规则分布分隔。 模塑料围绕芯片并且设置在芯片和基座之间的中间空间中。

公开(公告)号：US20070221318A1

公开(公告)日：2007-09-27

申请号：US11389550

申请日：2006-03-24

申请人： Martin Reiss ,  Bernd Scheibe ,  Stephan Blaszczak

发明人： Martin Reiss ,  Bernd Scheibe ,  Stephan Blaszczak

IPC分类号： B32B37/00

CPC分类号： H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/07802 ,  Y10T156/1978 ,  Y10T428/28 ,  H01L2924/00

摘要： An adhesion tape can be used for transferring an adhesive material onto the underside of a chip for further mounting of the chip onto a substrate. In order to provide effective compensation of the curvature of the wafers and of the dies without adversely affecting the mounting process in this case, an adhesion tape having an at least two-layered adhesive layer is provided. The adhesive layer comprises a first and a second adhesive layer. Both adhesive layers can be cured selectively with respect to one another.

摘要翻译： 粘合带可以用于将粘合剂材料转移到芯片的下侧，以进一步将芯片安装到基板上。 为了提供对晶片和模具的曲率的有效补偿，在这种情况下不会对安装过程产生不利影响，提供了具有至少两层粘合剂层的粘合带。 粘合剂层包括第一和第二粘合剂层。 两个粘合剂层可以相对于彼此选择性地固化。

公开(公告)号：US07271484B2

公开(公告)日：2007-09-18

申请号：US10950185

申请日：2004-09-24

申请人： Martin Reiss ,  Carsten Bender ,  Kerstin Nocke

发明人： Martin Reiss ,  Carsten Bender ,  Kerstin Nocke

IPC分类号： H01L23/488

CPC分类号： H05K3/3452 ,  B23K3/0638 ,  H05K3/3457 ,  H05K2201/0989 ,  H05K2201/099

摘要： A solderable device includes a substrate and a soldering pad overlying the substrate. A solder mask overlies the substrate and portions of the soldering pad. The solder mask has an opening that exposes a portion of the soldering pad. The opening has at least two edges that symmetrically overlie portions of the soldering pad.

摘要翻译： 可焊接装置包括衬底和覆盖衬底的焊盘。 焊接掩模覆盖基板和焊盘的部分。 焊接掩模具有露出焊盘一部分的开口。 该开口具有对称地覆盖焊盘部分的至少两个边缘。

公开(公告)号：US20060270109A1

公开(公告)日：2006-11-30

申请号：US11140687

申请日：2005-05-31

申请人： Stephan Blaszczak ,  Martin Reiss ,  Bernd Scheibe ,  Steffen Kroehnert ,  Knut Kahlisch ,  Ingolf Rau ,  Harry Hedler ,  Soo Park

发明人： Stephan Blaszczak ,  Martin Reiss ,  Bernd Scheibe ,  Steffen Kroehnert ,  Knut Kahlisch ,  Ingolf Rau ,  Harry Hedler ,  Soo Park

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Manufacturing method for an electronic component assembly and corresponding electronic component assembly The present invention provides a manufacturing method for an electronic component assembly and to a corresponding electronic component assembly. The method comprises the steps of: providing a substrate having a first and a second side and having at least one through-hole, said second side having a first plurality of solder connection pads; attaching a semiconductor chip to said first side of said substrate; performing a mould process on said substrate and said attached semiconductor chip so as to obtain a mould package, said mould package including at least one first mould section covering said semiconductor chip on the first side and at least one second mould section extending through said throughhole and protruding over said solder connection pads on the second side; and providing a printed circuit board having a surface with a second plurality of solder connection pads corresponding to said first plurality of solder connection pads; and soldering said mould package to said printed circuit board by means of solder balls between said first and second plurality of solder connection pads such that said at least one second section forms a spacer structure supporting said mould package on said surface of said printed circuit board.

摘要翻译： 电子部件组件和相应的电子部件组件的制造方法本发明提供一种用于电子部件组件和相应的电子部件组件的制造方法。 该方法包括以下步骤：提供具有第一和第二侧面并且具有至少一个通孔的基板，所述第二侧面具有第一多个焊接连接焊盘; 将半导体芯片附接到所述基板的所述第一侧; 在所述基板和所述附接的半导体芯片上执行模制工艺以获得模具包装，所述模具包装包括至少一个覆盖所述第一侧上的半导体芯片的第一模具部分和延伸穿过所述通孔的至少一个第二模具部分， 突出在第二侧上的焊料连接焊盘上; 以及提供具有表面的印刷电路板，所述表面具有对应于所述第一多个焊料连接焊盘的第二多个焊料连接焊盘; 以及通过所述第一和第二多个焊接连接焊盘之间的焊球将所述模具封装焊接到所述印刷电路板，使得所述至少一个第二部分形成支撑所述印刷电路板的所述表面上的所述模具封装的间隔结构。

公开(公告)号：US07036216B2

公开(公告)日：2006-05-02

申请号：US10252453

申请日：2002-09-23

申请人： Christian Hauser ,  Martin Reiss ,  Johann Winderl

发明人： Christian Hauser ,  Martin Reiss ,  Johann Winderl

IPC分类号： H05K3/34

CPC分类号： H01L24/80 ,  H01L23/3107 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/53174

摘要： An electrically conductive connection is produced between a chip and an external wiring configuration that is kept at a distance from the chip by spacers. Electrically conductive contact material is introduced into recesses in the external wiring configuration in order to produce the electrically conductive connection. This can be carried out economically, and allows a mechanically very robust electrical connection from the chip pads to the external wiring planes.

公开(公告)号：US20060017156A1

公开(公告)日：2006-01-26

申请号：US11184532

申请日：2005-07-19

申请人： Martin Reiss ,  Juergen Grafe ,  Anton Legen ,  Manuel Carmona

发明人： Martin Reiss ,  Juergen Grafe ,  Anton Legen ,  Manuel Carmona

IPC分类号： H01L23/34

CPC分类号： H01L25/50 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.

摘要翻译： 电子部件包括通过彼此间隔开并且布置在芯片和基部之间的中间空间中的多个粘合剂焊盘附接到基部的基部和芯片。 芯片与基座的互连电连接。 粘合垫在芯片的整个表面区域上以规则分布分隔。 模塑料围绕芯片并且设置在芯片和基座之间的中间空间中。

公开(公告)号：US20050087889A1

公开(公告)日：2005-04-28

申请号：US10501599

申请日：2003-01-14

申请人： Stephan Blaszczak ,  Martin Reiss

发明人： Stephan Blaszczak ,  Martin Reiss

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/28 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/56 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2924/00

摘要： The invention relates to an electronic component and a panel, the electronic component having a semiconductor chip with a wiring board and a plastic package. The plastic package is made up of two layers of plastic package molding compound arranged one on top of the other. These layers are created with the aid of a printing operation under normal atmosphere.

摘要翻译： 本发明涉及电子部件和面板，电子部件具有带有布线板的半导体芯片和塑料封装。 塑料包装由两层塑料包装模塑料组成，一层叠在一起。 这些层是在正常气氛下通过打印操作创建的。

公开(公告)号：US06873060B2

公开(公告)日：2005-03-29

申请号：US10396841

申请日：2003-03-25

申请人： Stephan Blaszczak ,  Martin Reiss

发明人： Stephan Blaszczak ,  Martin Reiss

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/28

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/48 ,  H01L24/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01039 ,  H01L2924/01068 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The electronic component has a semiconductor chip embedded in a plastic compound. The electronic component is produced by first producing a number of electronic components on a panel and subsequent dicing into single electronic components. The semiconductor chip of this component is disposed on a substrate the includes or is entirely formed of plastic and it is embedded in a plastic package molding compound. The plastic of the substrate has a glass transition temperature range which is lower than the glass transition temperature range of the plastic package molding compound.

摘要翻译： 电子部件具有嵌入塑料化合物中的半导体芯片。 电子部件通过首先在面板上产生多个电子部件并随后切割成单个电子部件来制造。 该部件的半导体芯片设置在基板上，其包括或完全由塑料形成，并且嵌入塑料封装模塑料中。 基板的塑料的玻璃化转变温度范围低于塑料封装模塑料的玻璃化转变温度范围。

公开(公告)号：US20050051896A1

公开(公告)日：2005-03-10

申请号：US10903873

申请日：2004-07-30

申请人： Martin Reiss ,  Kerstin Nocke ,  Carsten Bender

发明人： Martin Reiss ,  Kerstin Nocke ,  Carsten Bender

IPC分类号： H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/34 ,  H05K3/38 ,  H01L23/48

CPC分类号： H05K1/0271 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K1/036 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/10734 ,  H01L2924/00

摘要： The invention relates to an arrangement for improving module reliability, in particular the reliability of soldered connections on semiconductor products with BGA or BGA-like components to a substrate on which chips are attached by a die attach material, in particular substrate-based IC packages, solder balls mounted on the side that is opposite from the chip, on contact pads of the substrate on a patterned copper foil, being provided for the electrical connection to printed circuit boards, and the chip and the substrate on the chip side being encapsulated with a mold cap. With the invention, it is intended to provide an arrangement for improving module reliability with which stress acting on the solder balls during alternating thermal loading is reduced. According to the invention, an intermediate layer (3) which consists of a compliant or flexible material is arranged at least between the contact pads (2) and the substrate (1) or the printed circuit board.

摘要翻译： 本发明涉及一种用于提高模块可靠性的装置，特别是具有BGA或BGA类组件的半导体产品上的焊接连接的可靠性，其中芯片通过管芯附着材料，特别是基于衬底的IC封装在衬底上， 安装在与芯片相对的一侧的焊球，位于图案化铜箔上的衬底的接触焊盘上，用于与印刷电路板的电连接，并且芯片和芯片侧的衬底被封装在 模帽。 利用本发明，旨在提供一种用于提高模块可靠性的装置，通过该装置减少在交替热负荷期间作用在焊球上的应力。 根据本发明，由柔性或柔性材料组成的中间层（3）至少布置在接触垫（2）和基板（1）或印刷电路板之间。