发明申请
US20060238209A1 Vertical microprobes for contacting electronic components and method for making such probes
审中-公开
用于接触电子部件的垂直微探针和用于制造这种探针的方法
- 专利标题： Vertical microprobes for contacting electronic components and method for making such probes
- 专利标题（中）： 用于接触电子部件的垂直微探针和用于制造这种探针的方法
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申请号： US11325404申请日： 2006-01-03
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公开(公告)号： US20060238209A1公开(公告)日： 2006-10-26
- 发明人: Richard Chen , Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Kieun Kim , Gang Zhang , Dennis Smalley
- 申请人： Richard Chen , Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Kieun Kim , Gang Zhang , Dennis Smalley
- 专利权人： Microfabrica Inc.
- 当前专利权人： Microfabrica Inc.
- 主分类号： G01R31/02
- IPC分类号： G01R31/02
摘要：
Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both.
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