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公开(公告)号：US20240113487A1
公开(公告)日：2024-04-04
申请号：US18540526
申请日：2023-12-14
申请人： Microfabrica Inc.
发明人： Uri Frodis
摘要： Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g. probe structures for making contact between two electronic components for example in semiconductor wafer and chip and electronic component test applications). Some embodiments of the invention provide structures that include a core and shell on at least one layer where the layer including the shell is formed from at least one core material and at least one shell material wherein the shell material is different from a shell material or a single structural material on at least one of an immediately preceding layer or an immediately succeeding layer and wherein the core material is different from any core material on at least one of an immediately preceding layer or an immediately succeeding layer.
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公开(公告)号：US20240103040A1
公开(公告)日：2024-03-28
申请号：US17488176
申请日：2021-09-28
申请人： Microfabrica Inc.
发明人： Uri Frodis
CPC分类号： G01R1/06761 , G01R1/06744 , G01R1/07314 , G01R3/00
摘要： Vertical probes, formed of at least one layer that longitudinally includes a first and a second end and a central portion, with the central portion including at least three compliant arms wherein each of the two outer arms include a material having a yield strength greater than a first amount and the at least one intermediate arm is formed of a material having a yield strength less than the first yield strength amount wherein a yield strength of the material of the intermediate arm has a ratio to that of an outer arm of less than 1, more preferably less than 0.8, even more preferably less than 0.6, and most preferably less than 0.4.
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3.发明公开公开(公告)号：US20240094260A1
公开(公告)日：2024-03-21
申请号：US17384680
申请日：2021-07-23
申请人： Microfabrica Inc.
发明人： Onnik Yaglioglu
IPC分类号： B21D22/02
摘要： Improved probe arrays (e.g. buckling beam arrays) are formed using probe preforms that have desired array spacings but not intended individual probe configurations. Groups of preforms are engaged with one or more deformation plates that cause permanent (i.e. plastic) deformation of the probe preforms to provide probe from deformed probe preforms with desired probe configurations where at least part of the deformation of multiple probe preforms occur simultaneously and where multiple deformations of individual probe preforms may occur in parallel or in series and where deformation is provided by substantially lateral displacement of the one or more deformation plates relative to a permanent or temporary array substrate or one or more different deformation plates. In some variations, the substantial lateral displacement may be accompanied by longitudinal shifting as necessary to accommodate for change in relative longitudinal positioning as lateral displacement occurs.
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公开(公告)号：US20240094257A1
公开(公告)日：2024-03-21
申请号：US17968601
申请日：2022-10-18
申请人： Microfabrica Inc.
CPC分类号： G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
摘要： Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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5.发明公开公开(公告)号：US20240094255A1
公开(公告)日：2024-03-21
申请号：US17507598
申请日：2021-10-21
申请人： Microfabrica Inc.
CPC分类号： G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
摘要： Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.
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公开(公告)号：US20240094253A1
公开(公告)日：2024-03-21
申请号：US17572892
申请日：2022-01-11
申请人： Microfabrica Inc.
发明人： Garret R. Smalley
CPC分类号： G01R1/06761 , G01R1/06716 , G01R1/06738 , G01R1/06744 , G01R3/00
摘要： Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g., probe structures for making contact between two electronic components for example in semiconductor wafer, chip, and electronic component test applications). One or more layers of the structures include shell and core regions formed of different materials wherein the core regions are offset from a symmetric, longitudinally extending position
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7.发明公开公开(公告)号：US20240094249A1
公开(公告)日：2024-03-21
申请号：US17854756
申请日：2022-06-30
申请人： Microfabrica Inc.
发明人： Ming Ting Wu , Arun S. Veeramani
IPC分类号： G01R1/067
CPC分类号： G01R1/06722
摘要： Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat extension spring segment and wherein in some embodiments the probes also provide: (1) narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements, and/or (2) ratcheting elements on probe arms and/or frame elements to allow permanent or semi-permanent transition from a build state or initial state to a working state or pre-biased state.
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8.发明公开公开(公告)号：US20240017990A1
公开(公告)日：2024-01-18
申请号：US18301162
申请日：2023-04-14
申请人： Microfabrica Inc.
发明人： Duy P. Le , Rulon J. Larsen , Jeffrey A. Thompson , Uri Frodis , Dale S. McPherson , Kleun Kim , Mahmood Samiee , Nina C. Levy , Dennis R. Smalley
IPC分类号： B81C99/00
CPC分类号： B81C99/003 , B81C99/004 , B81C2201/0105 , B81C2201/013
摘要： Electronic test probes formed in a batch have a plurality of multi-material layers wherein at least one of the materials is a sacrificial material and at least one other material is a structural material. Successfully formed or good test probes are separated from unsuccessfully formed or bad test probes
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公开(公告)号：US20230314474A1
公开(公告)日：2023-10-05
申请号：US18295755
申请日：2023-04-04
申请人： Microfabrica Inc.
CPC分类号： G01R1/06722 , G01R1/06727 , G01R3/00
摘要： A method of forming a probe, comprises providing a first and a second probe modules, having respective compliant element functionally joining respective probes arm that directly or indirectly holds a first and a second tips and forming the probe by laterally and longitudinally aligning the first and second probe modules with their respective tips pointing away from each other.
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公开(公告)号：US11456235B1
公开(公告)日：2022-09-27
申请号：US17174218
申请日：2021-02-11
申请人： Microfabrica Inc.
发明人： Richard T. Chen , Will J. Tan
IPC分类号： H01L23/473 , F28F3/12 , F28F13/06 , H01L21/48 , H05K7/20
摘要： Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.
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