- 专利标题: Method of manufacturing a metal-ceramic circuit board
-
申请号: US11471441申请日: 2006-06-20
-
公开(公告)号: US20060242826A1公开(公告)日: 2006-11-02
- 发明人: Hideyo Osanai , Masahiro Furo
- 申请人: Hideyo Osanai , Masahiro Furo
- 专利权人: Dowa Mining Co., Ltd.
- 当前专利权人: Dowa Mining Co., Ltd.
- 优先权: JP2000-267206 20000904; JP078001/2000 20000321; JP273061/2000 20000908
- 主分类号: H05K3/36
- IPC分类号: H05K3/36 ; H05K3/20
摘要:
A metal-ceramic circuit board is characterized by being constituted by bonding on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member for an electronic circuit. A method of manufacturing a metal-ceramic circuit board is characterized by comprising the steps of melting aluminum or aluminum alloy in a vacuum or inert gas atmosphere to form a molten metal, contacting one surface of a ceramic substrate board directly with the molten metal in a vacuum or inert gas atmosphere, cooling the molten metal and the ceramic substrate board to form a base plate of aluminum or aluminum alloy, which is bonded directly on the ceramic substrate board without forming any oxidizing film therebetween and bonding a conductive metal member for an electronic circuit on the ceramic substrate board by using a brazing material. The base plate has a proof stress not higher than 320 (MPa) and a thickness not smaller than 1 mm.
公开/授权文献
- US07487585B2 Method of manufacturing a metal-ceramic circuit board 公开/授权日:2009-02-10
信息查询