A composite electronic component having a multi-layer wiring board, a first power terminal electrode, a second power terminal electrode, an external connection power supply terminal, a surface-mounted component, an insulator, and a power supply pattern. The first and the second power terminal electrodes are disposed on a first face of the multi-layer wiring board. The external connection power supply terminal is disposed on a second face opposite to the first face of the multi-layer wiring board and connected with the first power terminal electrode. The surface-mounted component is mounted on the first face of the multi-layer wiring board and connected with the first and the second power terminal electrodes at a first face thereof. The insulator covers at least a second face opposite to the first face of the surface-mounted component, the first power terminal electrode, and the second power terminal electrode with a first face thereof. The power supply pattern is disposed on a second face opposite to the first face of the insulator and connected with the first and the second power terminal electrodes.