- 专利标题: Wiring line structure and method for forming the same
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申请号: US11206381申请日: 2005-08-18
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公开(公告)号: US20060246713A1公开(公告)日: 2006-11-02
- 发明人: Tzeng-Guang Tsai , Kuo-Yu Huang , Hui-Fen Lin , Yu-Wei Liu
- 申请人: Tzeng-Guang Tsai , Kuo-Yu Huang , Hui-Fen Lin , Yu-Wei Liu
- 专利权人: AU Optronics Corp.
- 当前专利权人: AU Optronics Corp.
- 优先权: TW94114105 20050502
- 主分类号: H01L21/4763
- IPC分类号: H01L21/4763 ; H01L29/94 ; H01L29/76 ; H01L31/00
摘要:
The wiring line structure comprises a transparent substrate, a barrier layer, a metal layer, and a photosensitive protecting layer. The barrier layer and a metal layer are successively disposed on the transparent substrate. The photosensitive protecting layer is formed on the barrier layer and both sides of the metal layer. A method for fabricating the wiring line structure is also disclosed.