发明申请
- 专利标题： Encapsulating emissive portions of an OLED device
- 专利标题（中）： 封装OLED器件的发射部分
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申请号： US11116743申请日： 2005-04-28
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公开(公告)号： US20060246811A1公开(公告)日： 2006-11-02
- 发明人: Dustin Winters , Amalkumar Ghosh , Michael Boroson
- 申请人： Dustin Winters , Amalkumar Ghosh , Michael Boroson
- 专利权人： Eastman Kodak Company
- 当前专利权人： Eastman Kodak Company
- 主分类号： H05B33/10
- IPC分类号： H05B33/10 ; H05B33/04
摘要：
A method of providing an encapsulation layer over an emissive portion of an OLED device includes providing an OLED substrate having one or more OLED devices, each device having an emissive portion and a connector portion, positioning the OLED substrate in sealing engagement with at least one opening in a deposition chamber to define a deposition environment for the emissive portion(s) and a non-deposition environment for the connector portion(s), and depositing in the deposition environment an encapsulation layer onto the emissive portion of the OLED device through the opening without depositing the encapsulation layer over the connector portion.
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