发明申请
US20060249493A1 Methods for preparing ball grid array substrates via use of a laser
审中-公开
通过使用激光制备球栅阵列基板的方法
- 专利标题： Methods for preparing ball grid array substrates via use of a laser
- 专利标题（中）： 通过使用激光制备球栅阵列基板的方法
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申请号： US11485877申请日： 2006-07-13
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公开(公告)号： US20060249493A1公开(公告)日： 2006-11-09
- 发明人: Frank Hall
- 申请人： Frank Hall
- 主分类号： B23K26/38
- IPC分类号： B23K26/38
摘要：
A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.
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