公开(公告)号：US07993977B2

公开(公告)日：2011-08-09

申请号：US11772452

申请日：2007-07-02

申请人： Frank Hall ,  James Voelz

发明人： Frank Hall ,  James Voelz

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming molding standoff structures on integrated circuit devices is disclosed which includes forming a plurality of standoff structures on a substantially rectangular sheet of transparent material and, after forming the standoff structures, singulating the substantially rectangular sheet of transparent material into a plurality of individual transparent members, each of which comprise at least one of the plurality of standoff structures.

摘要翻译： 公开了一种在集成电路器件上形成成形支座结构的方法，其包括在基本上矩形的透明材料片上形成多个支座结构，并且在形成支座结构之后，将基本矩形的透明材料片分成多个单独的 透明构件，每个透明构件包括多个间隔结构中的至少一个。

公开(公告)号：US20070117249A1

公开(公告)日：2007-05-24

申请号：US11653861

申请日：2007-01-17

申请人： Frank Hall ,  William Reeder ,  Bret Street ,  James Derderian

发明人： Frank Hall ,  William Reeder ,  Bret Street ,  James Derderian

IPC分类号： H01L21/00

CPC分类号： H01L27/14683 ,  B33Y80/00 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/00014 ,  H01L2924/00

摘要： Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes disposing a plurality of discrete stand-offs on the support member. The discrete stand-offs are arranged in arrays relative to corresponding imaging dies. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member, and attaching a plurality of covers to corresponding stand-off arrays so that the covers are positioned over the image sensors.

摘要翻译： 本文公开了微电子成像单元和用于制造微电子成像单元的方法。 在一个实施例中，一种方法包括将多个单独的成像管芯放置在支撑构件上。 各个成像管芯包括图像传感器，可操作地耦合到图像传感器的集成电路以及可操作地耦合到集成电路的多个外部触点。 该方法还包括在支撑构件上设置多个离散支架。 离散的支架相对于相应的成像管芯排列成阵列。 该方法还包括将成像管芯的外部触头电连接到支撑构件上的对应的端子，以及将多个盖子附接到相应的支架阵列，使盖子位于图像传感器上方。

公开(公告)号：US20060249494A1

公开(公告)日：2006-11-09

申请号：US11485879

申请日：2006-07-13

申请人： Frank Hall

发明人： Frank Hall

IPC分类号： B23K26/38

CPC分类号： H01L23/544 ,  B08B7/0042 ,  B23K26/3584 ,  B23K2101/40 ,  G03F7/42 ,  H01L21/4864 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/01087 ,  H01L2924/09701 ,  H05K3/284 ,  H05K3/381 ,  H01L2924/00

摘要： A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

公开(公告)号：US20060249493A1

公开(公告)日：2006-11-09

申请号：US11485877

申请日：2006-07-13

申请人： Frank Hall

发明人： Frank Hall

IPC分类号： B23K26/38

CPC分类号： H01L23/544 ,  B08B7/0042 ,  B23K26/3584 ,  B23K2101/40 ,  G03F7/42 ,  H01L21/4864 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/01087 ,  H01L2924/09701 ,  H05K3/284 ,  H05K3/381 ,  H01L2924/00

摘要： A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

摘要翻译： 一种使用激光去除球栅阵列基板的表面污染和氧化的方法。 激光蚀刻可以被配置为覆盖整个基板或精确地指向环氧树脂模塑料/阻焊剂（EMC / SR）界面。 此外，激光可以用于粗糙化基板的表面，以在将管芯附着到基板上时提供更好的粘合性。

公开(公告)号：US20060249492A1

公开(公告)日：2006-11-09

申请号：US11485704

申请日：2006-07-13

申请人： Frank Hall

发明人： Frank Hall

IPC分类号： B23K26/38

CPC分类号： H01L23/544 ,  B08B7/0042 ,  B23K26/3584 ,  B23K2101/40 ,  G03F7/42 ,  H01L21/4864 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/01087 ,  H01L2924/09701 ,  H05K3/284 ,  H05K3/381 ,  H01L2924/00

摘要： A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

公开(公告)号：US20060237845A1

公开(公告)日：2006-10-26

申请号：US11428625

申请日：2006-07-05

申请人： Frank Hall ,  Cary Baerlocher

发明人： Frank Hall ,  Cary Baerlocher

IPC分类号： H01L23/48

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48644 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

公开(公告)号：US20060113291A1

公开(公告)日：2006-06-01

申请号：US11327817

申请日：2006-01-06

申请人： Frank Hall

发明人： Frank Hall

IPC分类号： B23K26/00

CPC分类号： H01L23/544 ,  B08B7/0042 ,  B23K26/3584 ,  B23K2101/40 ,  G03F7/42 ,  H01L21/4864 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/01087 ,  H01L2924/09701 ,  H05K3/284 ,  H05K3/381 ,  H01L2924/00

摘要： A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

摘要翻译： 一种使用激光去除球栅阵列基板的表面污染和氧化的方法。 激光蚀刻可以被配置为覆盖整个基板或精确地指向环氧树脂模塑料/阻焊剂（EMC / SR）界面。 此外，激光可以用于粗糙化基板的表面，以在将管芯附着到基板上时提供更好的粘合性。

公开(公告)号：US20050170658A1

公开(公告)日：2005-08-04

申请号：US11098161

申请日：2005-03-25

申请人： Frank Hall

发明人： Frank Hall

IPC分类号： B08B7/00 ,  B23K26/00 ,  G03F7/42 ,  H01L21/00 ,  H01L21/302 ,  H01L21/44 ,  H01L21/48 ,  H01L21/461 ,  H01L21/50 ,  H01L21/311

CPC分类号： H01L23/544 ,  B08B7/0042 ,  B23K26/3584 ,  B23K2101/40 ,  G03F7/42 ,  H01L21/4864 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/01087 ,  H01L2924/09701 ,  H05K3/284 ,  H05K3/381 ,  H01L2924/00

摘要： The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

摘要翻译： 本发明涉及使用激光去除球栅阵列基板的表面污染和氧化。 激光蚀刻可以被配置为覆盖整个基板或精确地指向环氧树脂模塑料/阻焊剂（EMC / SR）界面。 此外，激光可以用于粗糙化基板的表面，以在将管芯附着到基板上时提供更好的粘合性。

公开(公告)号：US20050026327A1

公开(公告)日：2005-02-03

申请号：US10929283

申请日：2004-08-30

申请人： Frank Hall ,  Cary Baerlocher

发明人： Frank Hall ,  Cary Baerlocher

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/34

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48644 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

摘要翻译： 集成电路封装，其将焊料球焊接在管芯的焊球焊盘和印刷电路板（PCB）的衬底焊盘之间。 焊料球与模具的任何电路（即“虚拟”）焊球电气断开，并且用于临时将模具保持在相对于PCB的位置，直到电路被引线接合，并且底部填充材料在 模具和PCB更加永久地连接在一起。 选择底部填充材料具有基本上等于焊球的CTE的热膨胀系数（CTE），以防止热失配问题。 围绕模具和底部填充材料设置包覆成型化合物并且围绕引线键合以完成包装。 模具上的焊球垫的各种布置包括柱状和行，角，对角，交叉和外围布置。

公开(公告)号：US5072795A

公开(公告)日：1991-12-17

申请号：US643486

申请日：1991-01-22

申请人： Steve R. Delgado ,  Robert J. Kotch ,  Frank Hall

发明人： Steve R. Delgado ,  Robert J. Kotch ,  Frank Hall

IPC分类号： E21B10/24

CPC分类号： E21B10/24

摘要： A fluid pressure compensator for a lubrication system in a rotary drill bit includes a diaphragm (44) with an enlarged thickness central portion (62) having a generally hemispherically shaped deformation (72) at its center to form a minimal thickness thereat progressively increasing to the enlarged thickness. A self sealing puncture (74) is provided at the center of the diaphragm (44) to relieve excess pressure differentials in the lubrication system internally of the drill bit and excess pressure differentials in the drilling fluid externally of the drill bit. The diaphragm (44) has an enlarged protuberance (64) about its outer periphery which is secured in sealing relation within a groove formed by sealing surfaces (66, 68, 70) on a leg (10) of the rotary bit and associated securing cap (46). A protective cup (42) supports the diaphragm (44) in an extended position and has dimples (58) for supporting the diaphragm (46) on the bottom (40) of the lubricant reservoir (49).

摘要翻译： 用于旋转钻头中的润滑系统的流体压力补偿器包括具有扩大的厚度中心部分（62）的隔膜（44），该中心部分在其中心处具有大致半球形变形（72），以形成最小厚度，其逐渐增加到 扩大厚度。 在隔膜（44）的中心处设置自密封穿刺（74），以减轻钻头内部的润滑系统中的过大的压力差和钻头外部的钻井液中的过大的压力差。 隔膜（44）围绕其外围具有一个扩大的突起（64），该突起（64）以密封关系固定在由旋转钻头的支脚（10）上的密封表面（66,68,70）形成的凹槽中，并且相关联的固定盖 （46）。 保护杯（42）将隔膜（44）支撑在延伸位置，并且具有用于将振动膜（46）支撑在润滑剂贮存器（49）的底部（40）上的凹坑（58）。