- 专利标题： Solid-state imaging device and method of manufacturing said solid-state imaging device
-
申请号： US11404902申请日： 2006-04-17
-
公开(公告)号： US20060252175A1公开(公告)日： 2006-11-09
- 发明人: Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
- 申请人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
- 优先权： JPP.2002-119262 20020422; JPP.2002-154528 20020528; JPP.2002-183072 20020624; JPP.2002-219645 20020729; JPP.2002-219791 20020729
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.
公开/授权文献
信息查询
IPC分类:
