发明申请
- 专利标题： Redundant wire bonds for increasing transducer reliability
- 专利标题（中）： 冗余导线键合，提高传感器的可靠性
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申请号： US10558729申请日： 2004-05-27
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公开(公告)号： US20060253027A1公开(公告)日： 2006-11-09
- 发明人: Showna Chang , Howell Schwartz , Carmine Decicco , David Doub , Bernard Savord , Francis Gurrie
- 申请人： Showna Chang , Howell Schwartz , Carmine Decicco , David Doub , Bernard Savord , Francis Gurrie
- 申请人地址： NL Eindhoven 5621
- 专利权人： Koninklijke Philips Electronics N.V.
- 当前专利权人： Koninklijke Philips Electronics N.V.
- 当前专利权人地址： NL Eindhoven 5621
- 国际申请： PCT/IB04/50795 WO 20040527
- 主分类号： A61B8/14
- IPC分类号： A61B8/14
摘要：
A method and a system for using redundant wire bonds (24) for increasing the reliability of ultrasound transducers is disclosed. An ultrasound transducer assembly having an ultrasound transducer, an integrated circuit (20), a plurality of wires (24), and a plurality of bond pads is provided. The integrated circuit includes enlarged lead pads for receiving redundant wire bonds. The ultrasoundtransducer includes a plurality of bond pads configured to receive the redundant wire bonds. Connecting wires, forming signal paths, connect the enlarged lead pads with the bond pads.
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