Redundant wire bonds for increasing transducer reliability
    1.
    发明申请
    Redundant wire bonds for increasing transducer reliability 审中-公开
    冗余导线键合,提高传感器的可靠性

    公开(公告)号:US20060253027A1

    公开(公告)日:2006-11-09

    申请号:US10558729

    申请日:2004-05-27

    IPC分类号: A61B8/14

    摘要: A method and a system for using redundant wire bonds (24) for increasing the reliability of ultrasound transducers is disclosed. An ultrasound transducer assembly having an ultrasound transducer, an integrated circuit (20), a plurality of wires (24), and a plurality of bond pads is provided. The integrated circuit includes enlarged lead pads for receiving redundant wire bonds. The ultrasoundtransducer includes a plurality of bond pads configured to receive the redundant wire bonds. Connecting wires, forming signal paths, connect the enlarged lead pads with the bond pads.

    摘要翻译: 公开了一种用于增加超声波换能器可靠性的冗余线接合(24)的方法和系统。 提供了具有超声波换能器,集成电路(20),多条电线(24)和多个接合焊盘的超声波换能器组件。 集成电路包括用于接收冗余引线键的扩大引线板。 超声波传感器包括被配置为接收冗余线接合的多个接合焊盘。 连接导线,形成信号路径,将扩大的引线焊盘与焊盘连接。