An apparatus for supplying chip-type electronic components is disclosed. The apparatus comprises a square pipe having a passageway appropriate to the outer shape of chip-type electronic components and formed in such a way that the chip-type electronic components align in a single row within the passageway, a component pickup portion formed at one end portion of the square pipe for picking up the chip-type electronic components, a hopper attached at the other end of the square pipe in such a way that one end thereof can be attached and removed for storing the chip-type electronic components, a component supply device for supplying chip-type electronic components inside the hopper to the square pipe by moving at least one of either the other end portion of the square pipe or the hopper up and down, and a component conveying device for conveying the chip-type electronic components inside the passageway of the square pipe into the component pickup portion by introducing negative pressure air or positive pressure air into the square pipe or the hopper.