发明申请
- 专利标题： Method for joinning substrates and objects
- 专利标题（中）： 连接基板和物体的方法
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申请号： US10565575申请日： 2004-08-13
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公开(公告)号： US20060266476A1公开(公告)日： 2006-11-30
- 发明人: Kalyan Sehanobish , Daniel Falla , Shaofu Wu , Mark Sonnenschein
- 申请人： Kalyan Sehanobish , Daniel Falla , Shaofu Wu , Mark Sonnenschein
- 国际申请： PCT/US04/26275 WO 20040813
- 主分类号： B32B7/12
- IPC分类号： B32B7/12 ; B32B37/12 ; C09J101/00 ; C09J4/00
摘要：
A method to join a substrate to an object is disclosed using a curable one or two part adhesive composition comprising an effective amount of a stabilized organoborane amine complex initiator and one or more monomers, oligomers, polymers or mixtures thereof having olefinic unsaturation which is capable of polymerization by free radical polymerization.
公开/授权文献
- US07638007B2 Method for joining substrates and objects 公开/授权日：2009-12-29
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