- 专利标题: Semi-conductor-on-insulator structure, semiconductor devices using the same and method of manufacturing the same
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申请号: US11397866申请日: 2006-04-05
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公开(公告)号: US20060267017A1公开(公告)日: 2006-11-30
- 发明人: Takashi Noguchi , Hans Cho , Wenxu Xianyu , Huaxiang Yin , Xiaoxin Zhang
- 申请人: Takashi Noguchi , Hans Cho , Wenxu Xianyu , Huaxiang Yin , Xiaoxin Zhang
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 优先权: KR10-2005-0043745 20050524
- 主分类号: H01L29/76
- IPC分类号: H01L29/76
摘要:
Semiconductor-on-insulator (SOI) structures, semiconductor devices using the same and methods of manufacturing the same, and more particularly, to a structure with a single-crystalline (for example, germanium (x-Ge)) layer on an insulating layer, semiconductor devices using the same, and methods of manufacturing the same. The SOI structure may include a single-crystalline substrate formed of a first semiconductor material, a first insulating layer formed on the substrate and having at least one window exposing a portion of the substrate, a first epitaxial growth region formed on a surface of the substrate exposed by the window and formed of at least one of the first semiconductor material and a second semiconductor material, and a first single-crystalline layer formed on the first insulating layer and the first epitaxial growth region and formed of the second semiconductor material, and crystallized using a surface of the first epitaxial growth region as a seed layer for crystallization.
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