发明申请
US20060272751A1 Heat mold device and a method of making a guide wire by using the same heat mold device 失效
热模具装置和使用相同的热模具装置制造导丝的方法

  • 专利标题: Heat mold device and a method of making a guide wire by using the same heat mold device
  • 专利标题(中): 热模具装置和使用相同的热模具装置制造导丝的方法
  • 申请号: US11443487
    申请日: 2006-05-31
  • 公开(公告)号: US20060272751A1
    公开(公告)日: 2006-12-07
  • 发明人: Tomihisa Kato
  • 申请人: Tomihisa Kato
  • 专利权人: ASAHI INTECC Co., Ltd.
  • 当前专利权人: ASAHI INTECC Co., Ltd.
  • 优先权: JP2005-166188 20050606
  • 主分类号: C21D9/52
  • IPC分类号: C21D9/52
Heat mold device and a method of making a guide wire by using the same heat mold device
摘要:
In a heat mold device 1 for a guide wire 9, the metallic mold body 2 is made from the material, the thermal expansional coefficient of which is the same of a metallic coild wire 91 to stabilize a shape-forming configuration 94. A plurality of the mold bodies 2 are arranged in a mold frame 6A to make the reverse side 22 of one mold body 2 tightly contact with the overse side 21 of other mold body 2 among the neighboring mold bodies 2. A jig arm 7A sandwiches an array of metallic mold bodies 2 and the side plate 63 to serve as a securement member 7. Upon manufacturing the guide wire 9 well-suited to the medical field, the heat mold device 1 renders it possible to make a high quality guide wire with a high productivity.
信息查询
0/0