发明申请
- 专利标题： Lead frame with attached components
- 专利标题（中）： 引线架带有附件
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申请号： US11146182申请日： 2005-06-06
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公开(公告)号： US20060273432A1公开(公告)日： 2006-12-07
- 发明人: Bernhard Lange , Steven Kummerl
- 申请人： Bernhard Lange , Steven Kummerl
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
According to an embodiment of the invention, a package comprises a lead frame, a first passive component, a first wire bond connection, and a mold compound. The lead frame has a first pair of resilient arms. The first passive component is disposed between the first pair of resilient arms. The first wire bond connection is disposed between the die and a portion of the lead frame adjacent the first passive component. The first wire bond connection is operable for communication between the die and the first passive component. The mold compound is disposed at least partially around the lead frame, the first passive component, the first wire bond connection, and the die.
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