发明申请
US20060278614A1 Polishing composition and method for defect improvement by reduced particle stiction on copper surface
审中-公开
通过减少铜表面的粒子沉积来改善缺陷的抛光组合物和方法
- 专利标题： Polishing composition and method for defect improvement by reduced particle stiction on copper surface
- 专利标题（中）： 通过减少铜表面的粒子沉积来改善缺陷的抛光组合物和方法
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申请号： US11147531申请日： 2005-06-08
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公开(公告)号： US20060278614A1公开(公告)日： 2006-12-14
- 发明人: Yuchun Wang , Fred Sun , Joseph Hawkins
- 申请人： Yuchun Wang , Fred Sun , Joseph Hawkins
- 申请人地址： US IL Aurora 60504
- 专利权人： Cabot Microelectronics Corporation
- 当前专利权人： Cabot Microelectronics Corporation
- 当前专利权人地址： US IL Aurora 60504
- 主分类号： C09K13/00
- IPC分类号： C09K13/00 ; C09K13/06 ; B44C1/22 ; C03C25/68
摘要：
A chemical-mechanical polishing composition comprising abrasive particles, a hydroxyquinoline, and a diamine compound comprising an ether group, and a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition.
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