发明申请
- 专利标题： Seeding of HTC fillers to form dendritic structures
- 专利标题（中）： 种植HTC填料以形成树枝状结构
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申请号： US11397000申请日： 2006-04-03
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公开(公告)号： US20060280873A1公开(公告)日： 2006-12-14
- 发明人: James Smith , Gary Stevens , John Wood
- 申请人： James Smith , Gary Stevens , John Wood
- 专利权人： Siemens Power Generation, Inc.
- 当前专利权人： Siemens Power Generation, Inc.
- 主分类号： B05D3/02
- IPC分类号： B05D3/02 ; B05D1/18
摘要：
In one embodiment the present invention provides for a method of forming HTC dendritic fillers 40 within a host resin matrix that comprises adding HTC seeds 42 to the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks 42, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillers 40 within the host resin matrix.
公开/授权文献
- US07592045B2 Seeding of HTC fillers to form dendritic structures 公开/授权日：2009-09-22
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