发明申请
- 专利标题: Semiconductor integrated circuit including a power supply, semiconductor system including a semiconductor integrated circuit, and method of forming a semiconductor integrated circuit
- 专利标题(中): 包括电源的半导体集成电路,包括半导体集成电路的半导体系统和形成半导体集成电路的方法
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申请号: US11447943申请日: 2006-06-07
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公开(公告)号: US20060284302A1公开(公告)日: 2006-12-21
- 发明人: Kyu-Hyoun Kim , Chang-Hyun Kim
- 申请人: Kyu-Hyoun Kim , Chang-Hyun Kim
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 优先权: KR10-2005-0052739 20050618
- 主分类号: H01L23/52
- IPC分类号: H01L23/52
摘要:
Provided are a semiconductor integrated circuit including a power supply, a semiconductor system including the semiconductor integrated circuit, and a method of forming the semiconductor integrated circuit. The semiconductor integrated circuit includes: a semiconductor substrate on a surface of which a plurality of electrical circuits and a plurality of power pads are mounted; an insulation layer stacked on the semiconductor substrate; a first conductive layer connected to a first power pad by a first via and stacked on the insulation layer; a second conductive layer connected to a second power pad by a second via, stacked on the insulation layer, and separated from the first insulation layer; and a power generation layer stacked on the first conductive layer and the second conductive layer and that generates voltage.
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