发明申请
US20060286346A1 Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material
失效
导电性多孔材料，使用其的树脂成型模具及制备导电性多孔材料的方法
- 专利标题： Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material
- 专利标题（中）： 导电性多孔材料，使用其的树脂成型模具及制备导电性多孔材料的方法
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申请号： US10557003申请日： 2005-01-25
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公开(公告)号： US20060286346A1公开(公告)日： 2006-12-21
- 发明人: Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
- 申请人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
- 优先权： JP2004-031678 20040209
- 国际申请： PCT/JP05/00902 WO 20050125
- 主分类号： B32B3/10
- IPC分类号： B32B3/10
摘要：
A conductive porous material includes a matrix having a sintered compact of an oxide, a communicating opening formed in the matrix, having a small diameter and being permeable to gas and impermeable to substance other than gas, and a conductive layer provided on an internal wall of the communicating opening and receiving a current to generate heat. As conductive material is used, an organic substance adheres on the internal wall of communicating opening. To address this, conductive layer is caused to generate heat to decompose and thus remove the organic substance and thus prevent the communicating opening from clogging.