公开(公告)号：US07901797B2

公开(公告)日：2011-03-08

申请号：US11988802

申请日：2006-12-27

申请人： Takaki Kuno ,  Yoshinori Noguchi ,  Keiji Maeda ,  Satoshi Kitaoka ,  Naoki Kawashima

发明人： Takaki Kuno ,  Yoshinori Noguchi ,  Keiji Maeda ,  Satoshi Kitaoka ,  Naoki Kawashima

IPC分类号： B32B9/00

CPC分类号： B29C33/38 ,  B29C33/56 ,  C04B37/001 ,  C04B2237/34 ,  C04B2237/348

摘要： An upper die has a cavity member constituting an inner bottom surface of a cavity, and a surrounding member. The cavity member is formed of a low adhesion material in accordance with the present invention, and includes a body portion and a surface layer formed on an undersurface of the body portion exposed to a fluid resin. The body portion is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer is formed of Y2O3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion. By bonding the body portion and the surface layer at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer.

摘要翻译： 上模具有构成腔的内底面的空腔构件和周围构件。 空腔构件由根据本发明的低粘合材料形成，并且包括主体部分和形成在暴露于流体树脂的主体部分的下表面上的表面层。 主体部分由3YSZ的第一材料和以预定比例混合的ZrN的第二材料形成。 表面层由相对于固化树脂具有低粘合性的Y2O3形成，并且具有比主体部分的热膨胀系数小的热膨胀系数。 通过在高温下接合主体部分和表面层，然后将其冷却，由于其热膨胀系数的差异，在表面层中引起压缩残余应力，并且表面层中存在压缩残余应力 。

公开(公告)号：US20100012816A1

公开(公告)日：2010-01-21

申请号：US12568585

申请日：2009-09-28

申请人： Takaki Kuno ,  Keiji Maeda ,  Yoshinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima ,  Seiichi Suda ,  Masato Yoshiya ,  Norio Yamaguchi

发明人： Takaki Kuno ,  Keiji Maeda ,  Yoshinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima ,  Seiichi Suda ,  Masato Yoshiya ,  Norio Yamaguchi

IPC分类号： B29C33/56

CPC分类号： B29C33/38 ,  B29C33/56 ,  G01N19/04 ,  H01L2224/48091 ,  Y10T428/2839 ,  H01L2924/00014

摘要： A mold surface (6) of an upper mold (1) with which a fluid resin comes into contact has an oxide (3) therein. The oxide (3) contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and an ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface (6), releasability between the cured resin and the mold surface (6) is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface (6) is established. With this evaluation method, a material with high releasability (3) can readily be provided. Further, if the material with high releasability (3) is used for the mold surface (6) of the upper mold (1), a mold for molding a resin having excellent releasability can be obtained.

摘要翻译： 流体树脂与其接触的上模具（1）的模具表面（6）在其中具有氧化物（3）。 氧化物（3）含有金属阳离子和离子。 基于金属阳离子的价数和离子的离子半径计算场强。 基于在强度值和固化树脂与模具表面（6）之间的粘合强度之间建立的预定关系，评估了固化树脂和模具表面（6）之间的脱模性。 由此，建立了评价固化树脂与模具表面（6）之间的脱模性的方法。 通过该评价方法，可以容易地提供具有高脱模性（3）的材料。 此外，如果将具有高脱模性（3）的材料用于上模（1）的模具表面（6），则可以获得用于模制具有优异的剥离性的树脂的模具。

公开(公告)号：US07486690B2

公开(公告)日：2009-02-03

申请号：US11114229

申请日：2005-04-26

申请人： Keiji Maeda

发明人： Keiji Maeda

IPC分类号： H04L12/56 ,  H04L12/28

CPC分类号： H04L12/4608 ,  H04L12/462

摘要： A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

摘要翻译： 传输源网桥将根据IEEE1394标准连接到串行总线的节点发送的数据包按照要发送的顺序收集到一个数据包中，然后将其发送到ATM网络上，从而传输目的地网桥接收该数据包， 将其分成多个较小的分组，并按照它们发送的顺序将它们按照IEEE1394标准传输到连接到串行总线的节点。

公开(公告)号：US07287975B2

公开(公告)日：2007-10-30

申请号：US10855210

申请日：2004-05-26

申请人： Kazuhiko Bandoh ,  Keiji Maeda ,  Takaki Kuno ,  Yoshinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima

发明人： Kazuhiko Bandoh ,  Keiji Maeda ,  Takaki Kuno ,  Yoshinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima

IPC分类号： B29C33/10

CPC分类号： B29C33/56 ,  B29C33/10 ,  B29C45/14655 ,  B29C45/34 ,  B29C70/72 ,  H01L2224/48091 ,  Y10S425/812 ,  H01L2924/00014

摘要： A resin mold material includes one-dimensional communicating holes extending substantially linearly from a mold surface and having diameters from 1 nm to less than 10 μm; a surface layer including the mold surface and the one-dimensional communicating holes; a support layer covering a back of the surface layer; and three-dimensional communicating holes communicating with the one-dimensional communicating holes in the support layer and having diameters larger than those of the one-dimensional communicating holes. Accordingly, a liquid resin is unlikely to enter the one-dimensional communicating holes, thereby reducing a contact area of the mold surface and the liquid resin, i.e., the mold surface is repellant to the liquid resin. Gas in a mold cavity bounded by the mold surface is discharged through the one-dimensional and three-dimensional communicating holes sequentially. Consequently, a release property of a molded product from the mold surface is improved and generation of voids is suppressed.

摘要翻译： 树脂模具材料包括从模具表面基本上线性延伸并且具有从1nm到小于10μm的直径的一维连通孔; 包括模具表面和一维连通孔的表面层; 覆盖表层的背面的支撑层; 以及与支撑层中的一维连通孔相通并且具有比一维连通孔的直径大的直径的三维连通孔。 因此，液体树脂不太可能进入一维连通孔，从而减小了模具表面和液体树脂的接触面积，即模具表面对液体树脂是排斥性的。 由模具表面界定的模腔中的气体依次通过一维和三维连通孔排出。 因此，来自模具表面的成型体的剥离性提高，空隙的产生被抑制。

公开(公告)号：US08611372B2

公开(公告)日：2013-12-17

申请号：US13097691

申请日：2011-04-29

申请人： Keiji Maeda

发明人： Keiji Maeda

IPC分类号： H04L12/28 ,  H04J1/16

CPC分类号： H04L12/4608 ,  H04L12/462

摘要： A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

摘要翻译： 传输源网桥将根据IEEE1394标准连接到串行总线的节点发送的数据包按照要发送的顺序收集到一个数据包中，然后将其发送到ATM网络上，从而传输目的地网桥接收该数据包， 将其分成多个较小的分组，并按照它们发送的顺序将它们按照IEEE1394标准传输到连接到串行总线的节点。

公开(公告)号：US20110206048A1

公开(公告)日：2011-08-25

申请号：US13097691

申请日：2011-04-29

申请人： Keiji MAEDA

发明人： Keiji MAEDA

IPC分类号： H04L12/56

CPC分类号： H04L12/4608 ,  H04L12/462

摘要： A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

摘要翻译： 传输源网桥将根据IEEE1394标准连接到串行总线的节点发送的数据包按照要发送的顺序收集到一个数据包中，然后将其发送到ATM网络上，从而传输目的地网桥接收该数据包， 将其分成多个较小的分组，并按照它们发送的顺序将它们按照IEEE1394标准传输到连接到串行总线的节点。

公开(公告)号：US20110042857A1

公开(公告)日：2011-02-24

申请号：US12914371

申请日：2010-10-28

申请人： Takaki KUNO ,  Keiji Maeda ,  Yoshinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima ,  Seiichi Suda ,  Masato Yoshiya ,  Norio Yamaguchi

发明人： Takaki KUNO ,  Keiji Maeda ,  Yoshinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima ,  Seiichi Suda ,  Masato Yoshiya ,  Norio Yamaguchi

IPC分类号： B28B7/36

CPC分类号： B29C33/38 ,  B29C33/56 ,  G01N19/04 ,  H01L2224/48091 ,  Y10T428/2839 ,  H01L2924/00014

摘要： A mold surface (6) of an upper mold (1) with which a fluid resin comes into contact has an oxide (3) therein. The oxide (3) contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and an ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface (6), releasability between the cured resin and the mold surface (6) is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface (6) is established. With this evaluation method, a material with high releasability (3) can readily be provided. Further, if the material with high releasability (3) is used for the mold surface (6) of the upper mold (1), a mold for molding a resin having excellent releasability can be obtained.

摘要翻译： 流体树脂与其接触的上模具（1）的模具表面（6）在其中具有氧化物（3）。 氧化物（3）含有金属阳离子和离子。 基于金属阳离子的价数和离子的离子半径计算场强。 基于在强度值和固化树脂与模具表面（6）之间的粘合强度之间建立的预定关系，评估了固化树脂和模具表面（6）之间的脱模性。 由此，建立了评价固化树脂与模具表面（6）之间的脱模性的方法。 通过该评价方法，可以容易地提供具有高脱模性（3）的材料。 此外，如果将具有高脱模性（3）的材料用于上模（1）的模具表面（6），则可以获得用于模制具有优异的剥离性的树脂的模具。

公开(公告)号：US20080296532A1

公开(公告)日：2008-12-04

申请号：US11920421

申请日：2006-12-27

申请人： Takaki Kuno ,  Yoshinori Noguchi ,  Keiji Maeda ,  Satoshi Kitaoka ,  Naoki Kawashima ,  Masato Yoshiya ,  Seiichi Suda

发明人： Takaki Kuno ,  Yoshinori Noguchi ,  Keiji Maeda ,  Satoshi Kitaoka ,  Naoki Kawashima ,  Masato Yoshiya ,  Seiichi Suda

IPC分类号： C09K3/00 ,  B28B1/00

CPC分类号： B29C33/56 ,  B29C33/60 ,  C04B35/50 ,  C04B35/505 ,  C04B35/645 ,  C04B2235/3213 ,  C04B2235/3225 ,  C04B2235/3227

摘要： A resin molding die has a molding surface formed of a low adhesion material formed of a solid solution of La—Y2O3 produced from Y2O3 and an other oxide of La2O3. La2O3 contains La, which has an ionic radius larger than Y3+, and is larger in basicity than Y2O3. The low adhesion material contains La2O3 at a predetermined ratio relative to a total of Y2O3 and La2O3. The low adhesion material thus has a large iconic radius contributing to a smaller number of sites per unit area than Y2O3, a larger basicity contributing to a smaller force binding the low adhesion material with a basic substance than Y2O3, and a ratio contributing to shape retention. The low adhesion material thus less adhesive and more shape-retentive than Y2O3 configures the molding surface. A low adhesion material that is less adhesive to a basic substance than Y2O3 is and excellently shape-retentive, and an excellently releasable and shape-retentive resin molding die can thus be obtained.

摘要翻译： 树脂成形模具具有由由Y 2 O 3制成的La-Y 2 O 3和La 2 O 3的其它氧化物的固溶体形成的低粘合性材料形成的成型面。 La2O3含有大于Y3 +的离子半径的La，其碱度比Y2O3大。 低粘附性材料相对于Y 2 O 3和La 2 O 3的总量以预定比例含有La 2 O 3。 因此，低粘附性材料具有大的标志性半径，有助于每单位面积比Y2O3更少的位置数，较大的碱度有助于结合低粘合材料与碱性物质比Y2O3更小的力，以及有助于形状保持的比例 。 因此，低粘合性材料因此比Y2O3更少的粘合性和更形状保持性构成了模制表面。 与Y 2 O 3相比，对碱性物质的粘合性较差的低粘合性材料具有良好的保持性，因此可以获得良好的脱模性和形状保持性的树脂成型模具。

公开(公告)号：US20080254286A1

公开(公告)日：2008-10-16

申请号：US10571683

申请日：2005-03-03

申请人： Takaki Kuno ,  Keiji Maeda ,  Yoshinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima ,  Seiichi Suda ,  Masato Yoshiya ,  Norio Yamaguchi

发明人： Takaki Kuno ,  Keiji Maeda ,  Yoshinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima ,  Seiichi Suda ,  Masato Yoshiya ,  Norio Yamaguchi

IPC分类号： B32B7/06

CPC分类号： B29C33/38 ,  B29C33/56 ,  G01N19/04 ,  H01L2224/48091 ,  Y10T428/2839 ,  H01L2924/00014

摘要： A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.

摘要翻译： 流体树脂与其接触的上模的模具表面具有氧化物。 氧化物含有金属阳离子和离子。 场强基于金属阳离子的价数和离子的离子半径计算。 基于在强度值和固化树脂与模具表面之间的粘合强度之间建立的预定关系，评估固化树脂和模具表面之间的脱模性。 由此，建立了评价固化树脂与模具表面之间的剥离性的方法。 通过该评价方法，可以容易地提供具有高脱模性的材料。 此外，如果将具有高脱模性的材料用于上模的模具表面，则可以获得具有优异的脱模性的树脂模制用模具。

公开(公告)号：US20070072346A1

公开(公告)日：2007-03-29

申请号：US11520584

申请日：2006-09-14

申请人： Keiji Maeda

发明人： Keiji Maeda

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L21/67126 ,  H01L2924/0002 ,  H01L2924/00

摘要： A mold for resin-seal-molding an electronic component is constituted by a first mold and a second mold. At a mold face (PL face) of the molds, a substrate supply-set surface having a flat shape without a step is provided. A pot block is joined with and separated from a side position of the mold intersecting perpendicularly with the mold face (PL face) of the molds. In a state where the mold face and the pot block are joined, a molten resin material in the pot block is injected into a cavity. The overall structure of the mold for resin-seal-molding an electronic component mounted on the substrate is simplified. Additionally, when resin-seal-molding the electronic component, a problem of variation in the thicknesses of the substrates is solved. Thus, resin flash formation on the substrate surface is prevented.

摘要翻译： 用于树脂密封成型电子部件的模具由第一模具和第二模具构成。 在模具的模具面（PL面）上设置没有台阶的平坦形状的基板供给台面。 罐模块与模具的与模具的模具面（PL面）垂直相交的侧面位置连接并分离。 在模具面和盆料块接合的状态下，将罐体中的熔融树脂材料注入空腔。 用于树脂密封成型安装在基板上的电子部件的模具的整体结构简化。 此外，当树脂密封成型电子部件时，解决了基板的厚度变化的问题。 因此，防止在基板表面上形成树脂。