发明申请
- 专利标题： Thermal interface with a patterned structure
- 专利标题（中）： 具有图形结构的热界面
-
申请号： US11437084申请日： 2006-05-19
-
公开(公告)号： US20060286712A1公开(公告)日： 2006-12-21
- 发明人: Thomas Brunschwiler , Urs Kloter , Ryan Linderman , Bruno Michel , Hugo Rothuizen
- 申请人： Thomas Brunschwiler , Urs Kloter , Ryan Linderman , Bruno Michel , Hugo Rothuizen
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 优先权： EP05010919.8 20050520
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/02
摘要：
An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in the interface material during interface formation in order to control the arrangement, orientation and concentration of particles at the end of the interface formation. The concept finds application in thermal interfaces and controlled placement of nano and micro particles and biological molecules.
公开/授权文献
- US07282799B2 Thermal interface with a patterned structure 公开/授权日：2007-10-16