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43 条记录 (耗时 0.022 秒)

    Cooling device
    3.
    发明申请
    Cooling device 失效
    冷却装置

    公开(公告)号：US20070119565A1

    公开(公告)日：2007-05-31

    申请号：US11598497

    申请日：2006-11-13

    申请人： Thomas Brunschwiler ,  Urs Kloter ,  Ryan Linderman ,  Bruno Michel ,  Hugo Rothuizen

    发明人： Thomas Brunschwiler ,  Urs Kloter ,  Ryan Linderman ,  Bruno Michel ,  Hugo Rothuizen

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling device has a large number of closely spaced impinging jets, adjacent an impingement gap, with parallel return paths for supplying coolant flow for the impinging jets with the least possible pressure drop using an interdigitated, branched hierarchical manifold. Surface enhancement features spanning the impingement gap form U-shaped microchannels between single impinging jets and single outlets.

    摘要翻译： 冷却装置具有大量紧密间隔的冲击射流，邻近冲击间隙，具有平行返回路径，用于使用交叉分支的分级歧管以最小可能的压降为冲击射流提供冷却剂流。 表面增强特征跨越冲击间隙形成单个冲击射流和单个出口之间的U形微通道。

    Heat spreader
    4.
    发明申请
    Heat spreader 审中-公开
    散热器

    公开(公告)号：US20070017659A1

    公开(公告)日：2007-01-25

    申请号：US11476516

    申请日：2006-06-28

    申请人： Thomas Brunschwiler ,  Urs Kloter ,  Ryan Linderman ,  Bruno Michel ,  Hugo Rothuizen

    发明人： Thomas Brunschwiler ,  Urs Kloter ,  Ryan Linderman ,  Bruno Michel ,  Hugo Rothuizen

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L2224/73253

    摘要： A flexible, self-contained active multi-phase heat spreader apparatus for cooling electronic components, the heat spreader having fluid sealed between two plates and a pumping mechanism to actuate multi-phase flow of the fluid. Thermal energy from an electronic component in contact with the heat spreader is dissipated from a core region via the working fluid to the entire heat spreader, and then to a heat sink. Surface enhancement features located between the two plates aid transfer of thermal energy from a first metal plate into the fluid.

    摘要翻译： 一种用于冷却电子部件的灵活的，独立的主动多相散热装置，散热器具有密封在两个板之间的流体和泵送机构以致动流体的多相流动。 来自与散热器接触的电子部件的热能从核心区域经由工作流体散发到整个散热器，然后散热到散热器。 位于两个板之间的表面增强特征有助于将热能从第一金属板传递到流体中。

    Patterned structure for a thermal interface
    5.
    发明申请
    Patterned structure for a thermal interface 失效
    用于热界面的图案化结构

    公开(公告)号：US20050263879A1

    公开(公告)日：2005-12-01

    申请号：US11141932

    申请日：2005-06-01

    申请人： Bruno Michel ,  Thomas Brunschwiler ,  Hugo Rothuizen ,  Urs Kloter

    发明人： Bruno Michel ,  Thomas Brunschwiler ,  Hugo Rothuizen ,  Urs Kloter

    IPC分类号： H01L23/10 ,  H01L23/42

    CPC分类号： H01L23/42 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least two types of grooves are arranged, namely first grooves having a larger width than second grooves. The first face comprises an array with protrusions that are confined by the second grooves, the array being divided by the first grooves into sub-arrays.

    摘要翻译： 本发明提供一种通过导热材料彼此接触的第一和第二面的热界面。 第一面包括至少部分地填充有导热材料的凹槽，其中布置至少两种类型的凹槽，即具有比第二凹槽宽的宽度的第一凹槽。 第一面包括具有被第二凹槽限制的突起的阵列，该阵列被第一凹槽划分为子阵列。

    COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS
    6.
    发明申请
    COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS 审中-公开
    用于移动电子系统的冷却泵送系统

    公开(公告)号：US20120273183A1

    公开(公告)日：2012-11-01

    申请号：US13546612

    申请日：2012-07-11

    申请人： Michel Bruno ,  Thomas Brunschwiler ,  Urs Kloter ,  Ryan J. Linderman ,  Erich Ruetsche

    发明人： Michel Bruno ,  Thomas Brunschwiler ,  Urs Kloter ,  Ryan J. Linderman ,  Erich Ruetsche

    IPC分类号： F28F27/00

    CPC分类号： H05K7/20272 ,  H05K7/20872

    摘要： A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass. A gear member is operatively connected between the mass and the force transfer member.

    摘要翻译： 用于移动电子系统的冷却剂泵送系统包括容纳冷却剂的冷却剂储存器，流体连接到冷却剂储存器的热交换器部件和可移动地安装到移动电子系统的质量块。 响应于移动电子系统的加速度和取向变化中的至少一个，质量沿着至少一个轴线移动。 冷却剂系统还包括可操作地连接在质量块和冷却剂储存器之间的力传递构件。 力传递构件响应于质量块的移动而促使来自冷却剂储存器的冷却剂通过热交换器构件。 齿轮构件可操作地连接在质量块和力传递构件之间。

    COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS
    7.
    发明申请
    COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS 审中-公开
    用于移动电子系统的冷却泵送系统

    公开(公告)号：US20100044005A1

    公开(公告)日：2010-02-25

    申请号：US12194973

    申请日：2008-08-20

    申请人： Michel Bruno ,  Thomas Brunschwiler ,  Urs Kloter ,  Ryan J. Linderman ,  Erich Ruetsche

    发明人： Michel Bruno ,  Thomas Brunschwiler ,  Urs Kloter ,  Ryan J. Linderman ,  Erich Ruetsche

    IPC分类号： B60H1/32

    CPC分类号： H05K7/20272 ,  H05K7/20872

    摘要： A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass.

    摘要翻译： 用于移动电子系统的冷却剂泵送系统包括容纳冷却剂的冷却剂储存器，流体连接到冷却剂储存器的热交换器部件和可移动地安装到移动电子系统的质量块。 响应于移动电子系统的加速度和取向变化中的至少一个，质量沿着至少一个轴线移动。 冷却剂系统还包括可操作地连接在质量块和冷却剂储存器之间的力传递构件。 力传递构件响应于质量块的移动而促使来自冷却剂储存器的冷却剂通过热交换器构件。