发明申请
- 专利标题： Semiconductor device having firmly secured heat spreader
- 专利标题（中）： 具有牢固固定的散热器的半导体器件
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申请号： US11168000申请日： 2005-06-27
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公开(公告)号： US20060289971A1公开(公告)日： 2006-12-28
- 发明人: Bernhard Lange , Steven Kummerl
- 申请人： Bernhard Lange , Steven Kummerl
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A semiconductor device comprising a leadframe (903), which has first (903a) and second (903b) surfaces, a planar pad (910) of a certain size, and a plurality of non-coplanar members (913) adjoining the pad. The device further has a heat spreader (920) with first (920a) and second (920b) surfaces, a planar pad of a size matching the leadframe pad size, and contours (922), into which the leadframe members are inserted so that the first spreader pad surface touches the second leadframe pad surface across the pad size. A semiconductor chip (904) is mounted on the first leadframe pad surface. Encapsulation material (930), preferably molding compound, covers the chip, but leaves the second spreader surface uncovered.
公开/授权文献
- US07635613B2 Semiconductor device having firmly secured heat spreader 公开/授权日：2009-12-22
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