发明申请
- 专利标题： Substrate processing device
- 专利标题（中）： 基板加工装置
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申请号： US10569378申请日： 2004-08-26
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公开(公告)号： US20070000612A1公开(公告)日： 2007-01-04
- 发明人: Toshihisa Nozawa , Takaaki Matsuoka
- 申请人： Toshihisa Nozawa , Takaaki Matsuoka
- 优先权： JP2003-309367 20030910
- 国际申请： PCT/JP04/12276 WO 20040826
- 主分类号： H01L21/306
- IPC分类号： H01L21/306 ; C23C16/00
摘要：
A substrate processing apparatus includes a plurality of process chambers (20) for applying a process to substrate accommodated therein and a conveyance case (24) that conveys the accommodated substrates to the process chambers (20) and a transfer mechanism that moves the conveyance case (24) along a moving path. The conveyance case accommodates the substrates in an isolated state from an external atmosphere. The plurality of process chambers (20) are arranged in an aligned state on both sides of a moving path of the conveyance case (24). The conveyance case (24) has two conveyance ports (24a) in response to conveyance ports (20a) of the process chambers (20) arranged in alignment in two rows.
公开/授权文献
- US07874781B2 Substrate processing apparatus 公开/授权日：2011-01-25
信息查询
IPC分类:
